Conference Information
NordPac 2024: IMAPS Nordic Microelectronics Packaging Conference and Exhibition
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Conference Partner Index (CP-I)
#421 of 511 in Electrical & Electronic Engineering
| Academic recognition (35%) | No data - scored at the neutral baseline of 50 | — |
| Submission selectivity (20%) | No data - scored at the neutral baseline of 50 | — |
| Editions held (20%) |
|
59 |
| Community attention (10%) |
|
8 |
| Public record completeness (15%) |
|
10 |
Inputs used: Editions on record: 8 · Researchers who opened this page in the past 24 months: 2
Missing from the public record:
Historical acceptance rates (+4.5) · Past editions (+3.0) · Best-paper records (+2.3) · Full call for papers (+2.3)
Organizers can add these from this page after claiming the conference; scores are recomputed nightly. How to raise this score
Confidence 45% - the share of the score backed by observed data rather than the neutral baseline. How this score is calculated · Browse the ranking · Algorithm version 1.1 · Computed 2026-10-01
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Based on the previous edition, the next deadline is estimated around 2027-01.
Call For Papers
NordPac 2024 (IMAPS Nordic Microelectronics Packaging Conference and Exhibition) is an academic conference held in Tampere, Finland on 2024-06-11. The paper submission deadline is 2024-01-31. Acceptance notifications are sent on 2024-06-01.
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Related Journals
| CCF | Full Name | Impact Factor | Publisher | ISSN |
|---|---|---|---|---|
| Microelectronics Journal | Elsevier | 0026-2692 | ||
| Microelectronics Reliability | 1.9 | Elsevier | 0026-2714 | |
| Russian Microelectronics | Springer | 1063-7397 | ||
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