会議情報
NordPac 2024: IMAPS Nordic Microelectronics Packaging Conference and Exhibition
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提出日: |
2024-01-31 |
通知日: |
2024-06-01 |
会議日: |
2024-06-11 |
場所: |
Tampere, Finland |
年: |
8 |
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論文募集
Topics
Proposed topics of microelectronics and packaging include:
Optoelectronics
Harsh environment Applications
Advanced Packaging
Electronics Reliability & Quality
Materials & Processes
Medical electronics
Power electronics
Wearable electronics
Green Technologies
Printed electronics
Advanced packaging for MEMS & sensors & sensor systems
Proposed topics of microelectronics and packaging include:
Optoelectronics
Harsh environment Applications
Advanced Packaging
Electronics Reliability & Quality
Materials & Processes
Medical electronics
Power electronics
Wearable electronics
Green Technologies
Printed electronics
Advanced packaging for MEMS & sensors & sensor systems
最終更新 Dou Sun 2023-12-04
関連会議
関連仕訳帳
| CCF | 完全な名前 | インパクト ・ ファクター | 出版社 | ISSN |
|---|---|---|---|---|
| IEEE Industrial Electronics Magazine | 5.7 | IEEE | 1932-4529 | |
| Production Planning & Control | 5.4 | Taylor & Francis | 0953-7287 | |
| Journal of Theoretical and Applied Electronic Commerce Research | 4.6 | MDPI | 0718-1876 | |
| AEU - International Journal of Electronics and Communications | 3.2 | Elsevier | 1434-8411 | |
| Microelectronic Engineering | 3.1 | Elsevier | 0167-9317 | |
| Journal of Electrical And Electronics Engineering | 2.3 | IJRDO | 2456-6055 | |
| Microelectronics Reliability | 1.9 | Elsevier | 0026-2714 | |
| Computer Methods in Biomechanics and Biomedical Engineering: Imaging & Visualization | 1.300 | Taylor & Francis | 2168-1163 | |
| c | Journal of Electronic Testing: Theory and Applications | 1.100 | Springer | 0923-8174 |
| ET Microwaves, Antennas & Propagation | 1.100 | IET | 1751-8725 |