Microelectronics Reliability, is dedicated to disseminating the latest research results and related information on the reliability of microelectronic devices, circuits and systems, from materials, process and manufacturing, to design, testing and operation. The coverage of the journal includes the following topics: measurement, understanding and analysis; evaluation and prediction; modelling and simulation; methodologies and mitigation. Papers which combine reliability with other important areas of microelectronics engineering, such as design, fabrication, integration, testing, and field operation will also be welcome, and practical papers reporting case studies in the field and specific application domains are particularly encouraged.

Most accepted papers will be published as Research Papers, describing significant advances and completed work. Papers reviewing important developing topics of general interest may be accepted for publication as Review Papers. All contributions are subject to peer review by leading experts in the field. Special issues are devoted to significant international conferences, or to important developing topics.

Microelectronics Reliability is an indispensable forum for the exchange of knowledge and experience between microelectronics reliability professionals from both academic and industrial environments, and all those associated in any way with a steadily growing microelectronics industry and its many fields of application.

Special Issue on Reliability and Failure Physics: selected papers from the ESREF 2024 Conference
Submission Date: 2024-11-15

This special issue of Microelectronics and Reliability comprises a selection of papers presented during the 35th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, ESREF 2024, at Parma (Italy) from September 23rd to 26th, 2024. This international symposium continues to focus on recent developments and future directions in Quality and Reliability Management of materials, devices and circuits for micro-, nano-, and optoelectronics. It provides a European forum for developing all aspects of reliability management and innovative analysis techniques for present and future electronic applications.

Guest editors:

Professor Francesco Iannuzzo
Aalborg University, Aalborg, Denmark
(Power Devices, Short circuit, Failure mechanisms, Life prediction)

Associate Professor Giovanna Mura
University of Cagliari, Cagliari, Italy
(Failure Analysis, Counterfeit electronics, Optoelectronics)

Associate Professor Paolo Cova
University of Parma, Parma, Italy
(Reliability and of power devices and systems, Thermal management, Thermomechanical degradation mechanisms)

Special issue information:

Conference Name:35th European Symposium on Reliability of Electron Devices, Failure Physics

Conference Date and Venue:   
23rd to 26th September 2024, Parma, Italy

Manuscript submission information:

Please submit your paper to Elsevier Microelectronics Reliability at https://www.journals.elsevier.com/microelectronics-reliability. The submission website for this journal is located at: https://www.editorialmanager.com/micrel/default.aspx. To ensure that all manuscripts are correctly identified for inclusion in the special issue you are editing, it is important that authors select the name of the special issue when they upload their manuscripts: "VSI: ESREF2024". 

Important Dates:

    Submission open date: 27 September 2024
    Manuscript Submission Deadline: 15 November 2024
    Editorial Acceptance Deadline: 28 February 2025

Keywords:

Materials, Microelectronic circuits, Electronic devices, Nanoelectronics, Optoelectronics, Power Devices and Systems