Journal Information
Microelectronics Reliability
http://www.journals.elsevier.com/microelectronics-reliability/
Impact Factor:
1.371
Publisher:
ELSEVIER
ISSN:
0026-2714
Viewed:
3251
Tracked:
1

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Call For Papers
Microelectronics Reliability is dedicated to disseminating the latest research results and related information on the reliability of microelectronic devices, circuits and systems. The coverage of the journal includes the following topics: physics and analysis; evaluation and prediction; modelling and simulation; methodologies and assurance. Papers which combine reliability with other important areas of microelectronics engineering, such as design, fabrication, packaging and testing, will also be welcome, and practical papers reporting case studies in the field are particularly encouraged.

Most accepted papers will be published as Research Papers, describing significant advances and completed work. Papers reviewing important developing topics of general interest may be accepted for publication as Review Papers. Urgent communications of a more preliminary nature and short reports on completed practical work of current interest may be considered for publication as Research Notes. All contributions are subject to peer review by leading experts in the field.
Additional regular features will include:
• Special issues devoted to significant international conferences, or to important developing topics
• Letters to the Editors
• Industrial news and updates
• Calendar of forthcoming events
• Book reviews

Microelectronics Reliability is an indispensable forum for the exchange of knowledge and experience between microelectronics reliability professionals from both academic and industrial environments, and all those associated in any way with a steadily growing microelectronics industry and its many fields of application.
Last updated by Dou Sun in 2017-08-05
Special Issues
Special Issue on ESREF 2018
Submission Date: 2018-03-12

ESREF 2018, the 29th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis will take place in Aalborg, Denmark from October 1 to 5, 2018.This international symposium will continue its almost 30-year history of focusing on the latest research developments and future directions in failure analysis, quality and reliability of materials, devices and circuits for micro-, opto-, power and space electronics. It historically provides an unpaired European forum to develop all aspects of reliability, including management and advanced analysis techniques for present and emerging semiconductor applications. All aspects related to specification, technology and manufacturing, testing, control and analysis are addressed in ESREF. SCOPE - Quality and Reliability assessment techniques and methods for Devices and Systems - Semiconductor Failure Mechanisms & Reliability - Progress in Failure Analysis: Defect Detection and Analysis - Reliability of Microwave and wide band-gap devices - Packaging and Assembly Reliability and Failure Analysis - Power Devices Reliability and Failure Analysis - Photonics Reliability - MEMS and sensors Reliability - Extreme environments
Last updated by Dou Sun in 2017-12-16
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