Información de la conferencia
NordPac 2024: IMAPS Nordic Microelectronics Packaging Conference and Exhibition
https://nordic.imapseurope.org/nordpac/Día de Entrega: |
2024-01-31 |
Fecha de Notificación: |
2024-06-01 |
Fecha de Conferencia: |
2024-06-11 |
Ubicación: |
Tampere, Finland |
Años: |
8 |
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Solicitud de Artículos
Topics Proposed topics of microelectronics and packaging include: Optoelectronics Harsh environment Applications Advanced Packaging Electronics Reliability & Quality Materials & Processes Medical electronics Power electronics Wearable electronics Green Technologies Printed electronics Advanced packaging for MEMS & sensors & sensor systems
Última Actualización Por Dou Sun en 2023-12-04
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