会议信息
NordPac 2024: IMAPS Nordic Microelectronics Packaging Conference and Exhibition
https://nordic.imapseurope.org/nordpac/截稿日期: |
2024-01-31 |
通知日期: |
2024-06-01 |
会议日期: |
2024-06-11 |
会议地点: |
Tampere, Finland |
届数: |
8 |
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征稿
Topics Proposed topics of microelectronics and packaging include: Optoelectronics Harsh environment Applications Advanced Packaging Electronics Reliability & Quality Materials & Processes Medical electronics Power electronics Wearable electronics Green Technologies Printed electronics Advanced packaging for MEMS & sensors & sensor systems
最后更新 Dou Sun 在 2023-12-04
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