会议信息
NordPac 2024: IMAPS Nordic Microelectronics Packaging Conference and Exhibition
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截稿日期: |
2024-01-31 |
通知日期: |
2024-06-01 |
会议日期: |
2024-06-11 |
会议地点: |
Tampere, Finland |
届数: |
8 |
浏览: 6110 关注: 0 参加: 0
征稿
Topics
Proposed topics of microelectronics and packaging include:
Optoelectronics
Harsh environment Applications
Advanced Packaging
Electronics Reliability & Quality
Materials & Processes
Medical electronics
Power electronics
Wearable electronics
Green Technologies
Printed electronics
Advanced packaging for MEMS & sensors & sensor systems
Proposed topics of microelectronics and packaging include:
Optoelectronics
Harsh environment Applications
Advanced Packaging
Electronics Reliability & Quality
Materials & Processes
Medical electronics
Power electronics
Wearable electronics
Green Technologies
Printed electronics
Advanced packaging for MEMS & sensors & sensor systems
最后更新 Dou Sun 在 2023-12-04
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