会议信息
NordPac 2024: IMAPS Nordic Microelectronics Packaging Conference and Exhibition
https://nordic.imapseurope.org/nordpac/截稿日期: |
2024-01-31 |
通知日期: |
2024-06-01 |
会议日期: |
2024-06-11 |
会议地点: |
Tampere, Finland |
届数: |
8 |
浏览: 5535 关注: 0 参加: 0
征稿
Topics Proposed topics of microelectronics and packaging include: Optoelectronics Harsh environment Applications Advanced Packaging Electronics Reliability & Quality Materials & Processes Medical electronics Power electronics Wearable electronics Green Technologies Printed electronics Advanced packaging for MEMS & sensors & sensor systems
最后更新 Dou Sun 在 2023-12-04
相关会议
相关期刊
| CCF | 全称 | 影响因子 | 出版商 | ISSN |
|---|---|---|---|---|
| IEEE Industrial Electronics Magazine | 5.7 | IEEE | 1932-4529 | |
| Production Planning & Control | 5.4 | Taylor & Francis | 0953-7287 | |
| Journal of Theoretical and Applied Electronic Commerce Research | 4.6 | MDPI | 0718-1876 | |
| AEU - International Journal of Electronics and Communications | 3.2 | Elsevier | 1434-8411 | |
| Microelectronic Engineering | 3.1 | Elsevier | 0167-9317 | |
| Journal of Electrical And Electronics Engineering | 2.3 | IJRDO | 2456-6055 | |
| Microelectronics Reliability | 1.9 | Elsevier | 0026-2714 | |
| Computer Methods in Biomechanics and Biomedical Engineering: Imaging & Visualization | 1.300 | Taylor & Francis | 2168-1163 | |
| c | Journal of Electronic Testing: Theory and Applications | 1.100 | Springer | 0923-8174 |
| ET Microwaves, Antennas & Propagation | 1.100 | IET | 1751-8725 |