Conference Information
NordPac 2024: IMAPS Nordic Microelectronics Packaging Conference and Exhibition
https://nordic.imapseurope.org/nordpac/
Submission Date:
2024-01-31
Notification Date:
2024-06-01
Conference Date:
2024-06-11
Location:
Tampere, Finland
Years:
8
Viewed: 1666   Tracked: 0   Attend: 0

Call For Papers
Topics

Proposed topics of microelectronics and packaging include:

Optoelectronics 	
Harsh environment Applications
Advanced Packaging 	
Electronics Reliability & Quality
Materials & Processes 	
Medical electronics
Power electronics 	
Wearable electronics
Green Technologies 	
Printed electronics
Advanced packaging for MEMS & sensors & sensor systems
Last updated by Dou Sun in 2023-12-04
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