Conference Information
NordPac 2024: IMAPS Nordic Microelectronics Packaging Conference and Exhibition
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Submission Date: |
2024-01-31 |
Notification Date: |
2024-06-01 |
Conference Date: |
2024-06-11 |
Location: |
Tampere, Finland |
Years: |
8 |
Viewed: 6107 Tracked: 0 Attend: 0
Call For Papers
Topics
Proposed topics of microelectronics and packaging include:
Optoelectronics
Harsh environment Applications
Advanced Packaging
Electronics Reliability & Quality
Materials & Processes
Medical electronics
Power electronics
Wearable electronics
Green Technologies
Printed electronics
Advanced packaging for MEMS & sensors & sensor systems
Proposed topics of microelectronics and packaging include:
Optoelectronics
Harsh environment Applications
Advanced Packaging
Electronics Reliability & Quality
Materials & Processes
Medical electronics
Power electronics
Wearable electronics
Green Technologies
Printed electronics
Advanced packaging for MEMS & sensors & sensor systems
Last updated by Dou Sun in 2023-12-04
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