Conference Information
NordPac 2024: IMAPS Nordic Microelectronics Packaging Conference and Exhibition
https://nordic.imapseurope.org/nordpac/Submission Date: |
2024-01-31 |
Notification Date: |
2024-06-01 |
Conference Date: |
2024-06-11 |
Location: |
Tampere, Finland |
Years: |
8 |
Viewed: 611 Tracked: 0 Attend: 0
Call For Papers
Topics Proposed topics of microelectronics and packaging include: Optoelectronics Harsh environment Applications Advanced Packaging Electronics Reliability & Quality Materials & Processes Medical electronics Power electronics Wearable electronics Green Technologies Printed electronics Advanced packaging for MEMS & sensors & sensor systems
Last updated by Dou Sun in 2023-12-04
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