Conference Information

ICDIS' 2026: International Symposium on Integrated Circuit Design and Integrated Systems

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Submission Date:
2026-06-15 Due tomorrow
Notification Date:
2026-06-30
Conference Date:
2026-08-01
Location:
Mongolia, China
Years:
3
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Call For Papers

ICDIS' 2026 (International Symposium on Integrated Circuit Design and Integrated Systems) is an academic conference held in Mongolia, China on 2026-08-01. The paper submission deadline is 2026-06-15. Acceptance notifications are sent on 2026-06-30.

The Technical Committee of the 3rd International Symposium on Integrated Circuit Design and Integrated Systems (ICDIS 2026) invites the submission of original research papers in the fields of integrated circuit design and integrated systems. Each submission is anonymously reviewed by an average of three independent reviewers, to ensure the final high standard and quality of submitted papers. Accepted papers will be presented in either oral or poster at the conference. Contributions are sought in the following areas: Analog, Digital, Mixed, and RF Circuits Design Low Power Tools and Designs Techniques Photonic Integrated Circuits (PIC) Design and Optimization CMOS-Compatible Photonic Devices and Applications CMOS Photonic Integrated Chips and Photonic Integrated Technology Combinatorial Logic Gate CMOS Memory and Array Structure Design VLSI Design Advanced Materials for Photonic and Optoelectronic Devices Silicon / Germanium Devices and Device Physics Modeling and Simulation of Organic Semiconductor Devices Test, Fault Tolerance, Reliability and Modelling Interconnect, Low K, High K and Other Process Technologies Integrated Circuits CAD, DFM Signal Processing Techniques for Hybrid Photonic-Electronic Systems Highly Integrated Front-end Circuits and Devices Integrated Circuits for Optical Communications Physical Design of Optoelectronic Integration Circuits and systems Devices and Circuits for Wireless Systems Devices, Hardware and Methods for Bio-Inspired and Neuromorphic Computing Manufacturing, Processing, Packaging and Testing Technology of Optoelectronic Integration and Devices Electronic Design Automation (EDA) Data Path in Digital Processor Architecture Embedded/Multiprocessor Systems Hardware-Software Co-Design and Co-Verification
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