Conference Information
ICPS 2018 : IEEE International Conference on Industrial Cyber-Physical Systems
http://icps2018.net/
Submission Date:
2018-02-15 Extended
Notification Date:
2018-03-10
Conference Date:
2018-05-15
Location:
Saint Petersburg, Russia
Years:
1
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Conference Location
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Call For Papers
Background

IEEE ICPS2018 is going to be the first of a premier conference series presenting the state of the art and future perspectives of Industrial Cyber-Physical Systems. An international forum, where industry experts, researchers, and academics share ideas and experiences surrounding frontier technologies, breakthrough and innovative solutions and applications, pertaining (i) how Industrial Cyber-Physical Components, Systems and Services are designed, implemented, deployed and operated by the industry; (ii) how they communicate and cooperate with each other as well as humans in real time, and (iii) how they are in conjunction with the Internet-of-Services and real-time analytics on Big Data, enhancing internal and cross-organizational engineering, management, control and automation functionalities for all stakeholders across a digitized value-chain.

Aim

The aim the IEEE Conference on Industrial Cyber-Physical System is to provide a platform to exchange research and innovation results, lessons learned from industrial practices associated to new paradigms and technologies such as Cyber-Physical Systems, Digital Economy, Industrie 4.0, Digitalization of the Industry and the Industrial-Internet-of-Things, among others.

Topics within the scope of the conference will include, but are not limited to:

    Engineering Methods and Tools for ICPS;
    Life Cycle and Value Stream for ICPS;
    ICPS Architectures and Standards;
    ICPS Interoperability;
    Connectivity OT/IT in ICPS;
    Robotics and ICPS;
    Internet-of-Things, Internet-of-Services and ICPS;
    Control and Management in ICPS;
    Security in ICPS;
    Education in ICPS;
    Digitalization and ICPS;
    ICPS and HMI;
    Safety in ICPS;
    ICPS Applications.

Special Sessions

To enhance the technical program and focus on specific topics and areas, ICPS2018 will include special sessions, in addition to regular ones. Special sessions can cover subjects or cross-subjects belonging to the topics of interest, or new relevant novel topics. If you are interested in organizing a special session, please contact the conference secretary at ss@icps2018.net.

Industry Forum, Tools Demonstrations & Exhibition

To support specific discussions among participants, ICPS2018 will include an Industry Forum, Tools Demonstration & Exhibition. The Industry Forum will consist on a set of technical sessions with the participation of leader-companies and institutions. A tool paper demonstration and/or exhibition with focus on the CPS-tool (but not on the application of the tool nor on the theory behind the tool) is possible. The tool should be available for use by other groups in a non-commercial basis. Please contact the conference secretary at industry-forum@icps2018.net.

Tutorials

Several tutorials are planned on the latest trends pertaining to Industrial Cyber-Physical Systems taking place on May 14th 2018. If you are interested in organizing a tutorial, please contact the conference secretary at tutorials@icps2018.net.

Submission of Papers

The working language of the conference is English. Prospective participants are requested to electronically submit full papers of their work (6 pages) following the IEEE template and instructions available here. Accepted papers will be published in IEEE proceedings to be included in IEEE-Xplore. Excellent papers may be invited to the IEEE Transaction on Industrial Informatics.

Paper Acceptance

Each accepted paper must be presented at the conference by one of the authors. Papers not presented will not be included in IEEE-Xplore. The final manuscript must be accompanied by a full registration fee payment. All conference attendees, including authors and session chairpersons, must pay the conference registration fee, and cover their own travel/lodging expenses.
Last updated by Dou Sun in 2018-02-05
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