会议信息

IDT 2015: IEEE International Design & Test Symposium

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截稿日期:
2015-10-11 延期
通知日期:
2015-10-30
会议日期:
2015-12-14
会议地点:
Dead Sea, Jordan
届数:
10
浏览: 17221   关注: 0   参加: 0
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会伴指数 (CP-I)

45.0 / 100
全站第 2,864 名 / 共 5,694 个会议 · 前 51%

系统与体系结构 第 227 / 340

学术认可 (35%) 无数据 —— 按中性基准 50 分计入 —
投稿选择性 (20%) 无数据 —— 按中性基准 50 分计入 —
会议传承 (20%)
65
社区关注 (10%)
8
资料公开度 (15%)
25

用到的输入: 有据可查的届次:10 · 过去 24 个月打开过本页的研究者:2 人

公开资料里还缺: 历年录用率 (+4.5) · 历届信息 (+3.0) · 最佳论文记录 (+2.3)
主办方认领本会议后,可直接在这一页补上;分数每晚重算。如何提升这个分数

置信度 45% —— 分数中有多大比例来自实际观测到的数据,而不是中性基准。 这个分数是怎么算出来的 · 查看完整榜单 · 算法版本 1.1 · 算于 2026-10-09

征稿

IDT 2015 (IEEE International Design & Test Symposium) is an academic conference held in Dead Sea, Jordan on 2015-12-14. The paper submission deadline is 2015-10-11 (extended). Acceptance notifications are sent on 2015-10-30.

The International Design and Test Symposium is an IEEE-sponsored technical event devoted to exploring emerging challenges and novel concepts related to the design, test, automation, and reliability of electronic systems ranging from integrated circuits through multi-chip modules and printed circuit boards to full systems. IDT is a unique forum to discuss best practices and novel ideas in design methods, tools, test, and reliability in the Middle East and Africa (MEA) region. The Symposium is initiated by and in affiliation with the IEEE TTTC (Test Technology Technical Council) and the 2015 edition is organized and sponsored by JUST (Jordan University of Science & Technology) and AAU (Amman Arab University) in collaboration with JCP (Jordan Competitiveness Program). It is also technically sponsored by IEEE CEDA (Council on Electronic Design Automation). The official language of the conference is English. Topics of interest include but are not limited to: Topics Design Methods and Tools IP and SOC Design Multiprocessor/Multi-core Systems Embedded Systems DFX Analog, Mixed Signal and RF Design High Speed Circuits Design Design of MEMS and MOEMS Low Voltage and Low Power systems Innovative Technologies Real Time Systems Simulation, Validation & Verification System Specification and Modeling Formal Methods and Verification System Design/Synthesis/Optimization Test and Reliability Yield Learning IP and SOC Testing Multiprocessor/Multi-Core Systems Test Memory & FPGA Test & Repair Delay Testing High Speed, Analog, Mixed Signal & RF Testing MEMS/MOEMS Testing Defect and Fault Modeling DFT, BIST and BISR On-line Testing / Fault Tolerance Fault Simulation, ATPG Reliability Failures/ Modeling Circuit Reliability Electronic System Reliability Regular Submissions IDT’15 invites original, unpublished paper submissions. Paper submissions should be complete manuscripts, not exceeding six pages (inclusive of figures, tables, and bibliography) in a standard IEEE two-column format. Authors should clearly explain the significance of the work, highlight novel features and describe its current status. All submissions are to be made electronically through the IDT’15 website. Detailed instructions for submissions are to be found at the IDT’15 website. A submission will be considered as evidence that, upon acceptance, the author(s) will prepare the final camera-ready version of the paper in time for inclusion in the proceedings, and will present the paper at the conference. All papers will be taken into consideration for the IDT 2015 Best Paper Award. In addition, a set of best papers will be considered for IEEE Design & Test. Special Session proposals IDT’15 solicits Special Sessions, such as (a) Hot-Topic session addressing and discussing the challenges in topics of interest to the symposium, (b) Embedded tutorials introducing and discussing topics of interest to the attendees, (c) Panels discussing visionary and/or controversial issues. Special Session proposals consist of an extended summary (up to 1500 words) as PDF file, describing the session content and format, and must be submitted electronically through the IDT’15 website. Publications IDT’15 will produce a Formal Proceedings of accepted papers, published by the IEEE. The proceedings will be available to all participants during the symposium.
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