Conference Information

MDTS 2027: Microelectronics Design and Test Symposium

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Submission Date:
2027-01-10 Due in 114 days
Notification Date:
2027-02-21
Conference Date:
2027-05-17
Location:
Albany, New York, USA
Years:
Viewed: 11594   Tracked: 0   Attend: 0

Conference Partner Index (CP-I)

56.2 / 100
Ranked #758 of 5,682 conferences · Top 14%

#22 of 509 in Electrical & Electronic Engineering #111 of 341 in Systems & Architecture

Academic recognition (35%) No data - scored at the neutral baseline of 50 —
Submission selectivity (20%) No data - scored at the neutral baseline of 50 —
Editions held (20%)
97
Community attention (10%)
10
Public record completeness (15%)
55

Inputs used: Editions on record: 36 · Researchers who opened this page in the past 24 months: 3

Missing from the public record: Historical acceptance rates (+4.5) · Best-paper records (+2.3)
Organizers can add these from this page after claiming the conference; scores are recomputed nightly. How to raise this score

Confidence 45% - the share of the score backed by observed data rather than the neutral baseline. How this score is calculated · Browse the ranking · Algorithm version 1.1 · Computed 2026-09-18

Call For Papers

MDTS 2027 (Microelectronics Design and Test Symposium) is an academic conference held in Albany, New York, USA on 2027-05-17. The paper submission deadline is 2027-01-10. Acceptance notifications are sent on 2027-02-21.

Theme Topics The Program Committee invites researchers and practitioners to submit tutorial, panel, and special session proposals. The committee also encourages authors to submit original, unpublished papers. Topics of interest include, but are not limited to: Hardware Security Microarchitectural attacks Side channel attacks and mitigation (Anti –)Reverse engineering and physical attacks Fault attacks Hardware obfuscation Computer-aided design (CAD) for security SoC security, Field-programmable gate array (FPGA) and reconfigurable fabric security Internet-of-Things (IoTs) and cyber physical system security Micro Devices, Circuits and Microsystems Analog/mixed-signal/radio frequency (RF) circuits Low-power low-voltage design Sensors and sensing systems Smart system design for automotive, automation and robotics Circuits and systems for approximate and evolvable computing Memristor-based devices Lab-on-Chip, wearable and implantable devices Heterogeneous integration and multi-scale chiplet-based packaging architecture Biomedical, Photonics, and Quantum Electronics Biomedical and bio-inspired circuits and systems Microelectromechanical systems (MEMS) sensors and bioelectronics Nanobiophotonics for optical imaging, sensing, and diagnostics Terahertz photonics for communications Photodetectors, sensors, and imaging Photonics for energy and green photonics AI/ML integration with biodevices Micro/Nano electronics for biosensing and bio-actuation Electronic Design & Test Methodologies and Electronic Design Automation (EDA) Electronic design tools, processes and methodologies EDA for 3D integrations and advanced packaging EDA for bio-inspired and neuromorphic systems EDA tools, methodologies and applications for Photonics devices, circuit, and system design System-on-Chip (SoC)/intellectual property (IP) testing strategies Hardware/software co-verification Design for testability (DFT) & built-in self-test (BIST) for digital designs, analog/mixed-signal integrated circuits (ICs), SoCs, and memories Design verification/validation Machine learning datasets for microelectronics design and test Emerging Technologies, Materials, and Applications Emerging low-dimensional materials (carbon nanotubes, transition metal dichalcogenides, and metal oxides). Computing-in-memory architectures Neural networks, AI, ML, and DL in design and test of microelectronics IoT, edge nodes, or pipelines for real-time data visualizations and monitoring in design and test of microelectronics Application of cognitive, neuromorphic and quantum computing High-speed serializer/ deserializer (SerDes) Next-generation design-technology co-optimization Advanced interconnect 3D manufacturing Quantum Computing Power Electronics and Applications Power conversion topologies Energy storage systems Power electronic packaging Electric Vehicles (EV) and charging infrastructure Wireless power transfer
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