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MDTS 2027: Microelectronics Design and Test Symposium

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截稿日期:
2027-01-10 还有 114 天
通知日期:
2027-02-21
会议日期:
2027-05-17
会议地点:
Albany, New York, USA
届数:
浏览: 11598   关注: 0   参加: 0

会伴指数 (CP-I)

56.2 / 100
全站第 758 名 / 共 5,682 个会议 · 前 14%

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学术认可 (35%) 无数据 —— 按中性基准 50 分计入 —
投稿选择性 (20%) 无数据 —— 按中性基准 50 分计入 —
会议传承 (20%)
97
社区关注 (10%)
10
资料公开度 (15%)
55

用到的输入: 有据可查的届次：36 · 过去 24 个月打开过本页的研究者：3 人

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置信度 45% —— 分数中有多大比例来自实际观测到的数据，而不是中性基准。 这个分数是怎么算出来的 · 查看完整榜单 · 算法版本 1.1 · 算于 2026-09-18

征稿

MDTS 2027 (Microelectronics Design and Test Symposium) is an academic conference held in Albany, New York, USA on 2027-05-17. The paper submission deadline is 2027-01-10. Acceptance notifications are sent on 2027-02-21.

Theme Topics The Program Committee invites researchers and practitioners to submit tutorial, panel, and special session proposals. The committee also encourages authors to submit original, unpublished papers. Topics of interest include, but are not limited to: Hardware Security Microarchitectural attacks Side channel attacks and mitigation (Anti –)Reverse engineering and physical attacks Fault attacks Hardware obfuscation Computer-aided design (CAD) for security SoC security, Field-programmable gate array (FPGA) and reconfigurable fabric security Internet-of-Things (IoTs) and cyber physical system security Micro Devices, Circuits and Microsystems Analog/mixed-signal/radio frequency (RF) circuits Low-power low-voltage design Sensors and sensing systems Smart system design for automotive, automation and robotics Circuits and systems for approximate and evolvable computing Memristor-based devices Lab-on-Chip, wearable and implantable devices Heterogeneous integration and multi-scale chiplet-based packaging architecture Biomedical, Photonics, and Quantum Electronics Biomedical and bio-inspired circuits and systems Microelectromechanical systems (MEMS) sensors and bioelectronics Nanobiophotonics for optical imaging, sensing, and diagnostics Terahertz photonics for communications Photodetectors, sensors, and imaging Photonics for energy and green photonics AI/ML integration with biodevices Micro/Nano electronics for biosensing and bio-actuation Electronic Design & Test Methodologies and Electronic Design Automation (EDA) Electronic design tools, processes and methodologies EDA for 3D integrations and advanced packaging EDA for bio-inspired and neuromorphic systems EDA tools, methodologies and applications for Photonics devices, circuit, and system design System-on-Chip (SoC)/intellectual property (IP) testing strategies Hardware/software co-verification Design for testability (DFT) & built-in self-test (BIST) for digital designs, analog/mixed-signal integrated circuits (ICs), SoCs, and memories Design verification/validation Machine learning datasets for microelectronics design and test Emerging Technologies, Materials, and Applications Emerging low-dimensional materials (carbon nanotubes, transition metal dichalcogenides, and metal oxides). Computing-in-memory architectures Neural networks, AI, ML, and DL in design and test of microelectronics IoT, edge nodes, or pipelines for real-time data visualizations and monitoring in design and test of microelectronics Application of cognitive, neuromorphic and quantum computing High-speed serializer/ deserializer (SerDes) Next-generation design-technology co-optimization Advanced interconnect 3D manufacturing Quantum Computing Power Electronics and Applications Power conversion topologies Energy storage systems Power electronic packaging Electric Vehicles (EV) and charging infrastructure Wireless power transfer
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