Conference Information
ETS 2021: European Test Symposium
http://ets2021.eu
Submission Date:
2020-12-17
Notification Date:
2021-02-12
Conference Date:
2021-05-24
Location:
Brugge, Belgium
Years:
26
CCF: c   QUALIS: b2   Viewed: 10753   Tracked: 17   Attend: 0

Conference Location
Call For Papers
The IEEE European Test Symposium (ETS) is Europe’s premier forum dedicated to presenting and discussing scientific results, emerging ideas, hot topics and new trends, industrial case-studies and applications, in the area of electronic-based circuits and system testing, reliability, safety, security and validation. The program includes excellent keynotes, scientific papers, panels, tutorials, workshops and highlights from industry. In 2021, ETS will take place in the Crowne Plaza Hotel in Bruges (Belgium). The city is known for its picturesque Old Town with its medieval architecture (UNESCO heritage) and vibrant museums. ETS’21 is organized jointly by KU Leuven and imec, which co-sponsor the event together with the IEEE Council on Electronic Design Automation (CEDA).

In addition to regular technical papers (presenting novel, unpublished, and complete research), ETS’21 provides the opportunity of submitting scientific contributions for hot-topic papers (presenting early novel ideas) or case-study papers (presenting relevant industrial case studies). Evaluation criteria will depend on the submission category. In addition, submissions are solicited for the PhD Forum as well as proposals for special sessions, panels, embedded tutorials and workshops. Before and after the main ETS’21 symposium, the Test Spring School and Fringe Workshops will be organized.

You are invited to participate and submit your contributions to ETS’21. The areas of interest include (but are not limited to) the following topics:

3D IC and SiP Test	
Heterogeneous and Emerging Architectures
Analog, Mixed-Signal and RF Test	
High-Speed I/0 Test
Approximate Circuit Testing	
IoT and CPS Dependability
ATE Hardware and Software	
Low-Power Test
Automatic Test Generation	
Machine Learning and Test
Automotive and Avionics Test	
Memory Test and Repair
Board Test and Diagnosis	
Microsystems / MEMS / Sensors Test
Built-In Self-Test	
On-line Test
Current-Based Test	
Power- / Thermal-Aware Test
Defect-Based Test	
Processor Test (Multi-Core, GPU, CPU, Neuromorphic, etc.)
Delay and Performance Test	
Security-Test Trade-offs
Design for Test	
Self-X (Awareness, Repair, Test, etc.)
DfX (Design for Manufacturing, Reliability, Yield, etc.)	
Signal Integrity Test
Diagnosis and Silicon Debug	
SoC and NoC Test
Economics of Test	
Standards in Test
Extra-Functional Aspects	
Test for Reversible and Quantum Circuits
Failure Analysis	
Test of Reconfigurable Systems (FPGA, CPLD, etc.)
Fault Modeling	
Test, Reliability and Security of Emerging Technologies
Fault Simulation	
Trojan Detection
Fault Tolerance	
Verification and Validation
Functional Safety	
Yield Analysis and Enhancement
Hardware Security	

Publications

ETS’21 will produce Formal Proceedings of scientific papers with ISBN number that will be indexed by the IEEE Xplore Digital Library. All accepted papers submitted in one of the three categories – i.e. regular, hot topic, and case study – will be included in the Formal Proceedings (hot-topic and case-study papers will be labeled as such).

Submissions

    Scientific papers for the Formal Proceedings:
        Regular Papers, presenting novel and complete research work;
        Hot-Topic Papers, presenting early innovative ideas with incomplete results, emerging and future test/reliability/safety problems, or identifying open problems that merit innovative future research;
        Case-Study Papers, presenting relevant industrial (or industrial collaboration) data that demonstrate a previously published concept, or that can help further research advancements.
    PhD Forum Contributions from students eager to discuss their on-going research.
    Proposals for Panels, Embedded Tutorials, Special Sessions and Fringe Workshops.
    Industrial Presentations and Table-top Demos focusing on new features of test/reliability/safety- related products.
Last updated by Dou Sun in 2020-05-15
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