Applications of Computer Vision
Submission Date: 2021-09-30

Dear Colleagues,

Computer vision (CV) techniques are widely used by the practicing engineer to solve a whole range of real vision problems. Our aim is to encourage scientists to publish their experimental and theoretical results in as much detail as possible, covering some practical application of CV methods in all branches of science and engineering. Submitted papers should report some novel aspect of CV use for a real-world engineering application and also validated using data sets. There is no restriction on the length of the papers. Electronic files and software regarding the full details of the calculation or experimental procedure, if unable to be published in a normal way, can be deposited as supplementary electronic material.

The website of the SI is https://www.mdpi.com/journal/electronics/special_issues/Applications_CV

Focal points of the Special Issue include but are not limited to innovative applications of:

    Medical and biological imaging
    Industrial inspection
    Robotics
    Photo and video interpretation
    Image retrieval
    Video analysis and annotation
    Multimedia
    Sensors and more.

Dr. Eva Cernadas
Guest Editor

Special Issue on Design and Implementation of RF Front-Ends for Next Generation Communication Systems
Submission Date: 2022-10-31

Dear Colleagues,

The rapid increase in the demands of data transmission rates driven by emerging applications has imposed stringent requirements in the operation frequency and bandwidth for next-generation wireless communication systems. To accommodate the requirements of modern communication systems, new design and implementation technologies for front-end subsystems are necessary. New technologies that lead to compact size, ease of integration, and performance improvement are critical at microwave/millimeter-wave frequencies. This Special Issue is thus devoted to the presentation of the latest developments in passive and active components and circuits in the front ends for the next generation of communication systems. All researchers in the field are invited to contribute their original unpublished works. Both research and review papers are welcome.

Topics of interest include but are not limited to:

- Device technologies for microwave/millimeter-wave applications;
- Power-combining techniques;
- Low-noise amplifier circuits;
- Power amplifier circuits;
- Switches;
- Antennas;
- Antenna arrays;
- Filters;
- Passive components;
- Materials for microwave/millimeter-wave applications.

For further information, please visit:
https://www.mdpi.com/journal/electronics/special_issues/rf_front_end

Prof. Dr. Heng-Tung Hsu
Prof. Dr. Jeng-Han Tsai
Dr. Kuniyuki Kakushima
Guest Editors

Special Issue on "Recent Advanced Applications of Rehabilitation and Medical Robotics"
Submission Date: 2022-10-31

Special Issue link: 
https://www.mdpi.com/journal/electronics/special_issues/Rehabilit_Medical_Robotics

Dear Colleagues,

Robotic technologies are able to provide precise and accurate sensing and movement capabilities. Recently, advances in the applications of rehabilitation and medical robots have led to powerful insights about the nature of understanding and augmenting rehabilitation and medical treatments. However, new and challenging theoretical and technological problems are being posed. One can apply state-of-the-art robotic technologies in different ways, including robot-assisted surgery, upper and lower limb rehabilitation, cognitive computation, behavioural intelligence and statistics. Such convergence of interests is encouraging, but few researchers in this active area communicate across disciplinary boundaries, and even fewer are skilled in the ‘language’ and techniques of more than one approach. With this new era of rehabilitation and medical robotics, much research is needed in order to continue to advance the field and also to evaluate the multidisciplinary concerns of the existing robotics and learning techniques.

The main aim of this Special Issue is to seek high-quality submissions that highlight emerging applications and address recent breakthroughs in medical and rehabilitation robotics. The topics of interest include, but are not limited to:

    Robot-assisted surgery;
    Upper and lower limb rehabilitation;
    Medical image analysis;
    EEG/sEMG data analytics;
    Stroke rehabilitation;
    Brain-computer interfaces;
    Haptic sensing;
    Neuro-imaging based diagnosis;
    Neural image captioning;
    Cognitive computation for healthcare;
    Targeted neuroplasticity;
    Human activity recognition;
    Extraction and optimisation techniques;
    Human-machine interfaces/integrations;
    Humanoid service robotics;
    Teleoperation/ telerobotics;
    Medical devices and instrumentation;
    Mobile healthcare;
    Rehabilitation games.

Prof. Dr. Pengcheng Liu
Prof. Dr. Guibin Bian
Dr. Anwar P.P. Abdul Majeed
Prof. Dr. Ahmad Athif
Guest Editors

Special Issue on Stretchable and Wearable Electronics
Submission Date: 2022-12-20

Dear Colleagues,

Stretchable and wearable electronics have emerged and received significant interest in both research and commerce in recent years. This interest stems from the huge demand for their unique electrical and mechanical performance, which can endow electronic devices unprecedented applications.

On the one hand, they can be used in circumstances where they were previously difficult to apply, for example, human skin, tissue-like electronics, stretchable supercapacitors and other circumstances, which greatly broadens the application scenarios for electronic devices. On the other hand, a large number of solution-processable organic or nano materials are adopted in them, and printing technology such as 3D printing, ink-jet printing and some other deposition methods, such as thermal evaporation, sputtering and chemical vapor deposition (CVD), alone or in combination, can also be used to fabricate them. These features make them significantly more available compared to traditional silicon-based electronics, making the manufacturing cost significantly lower and facilitating the diffusion of flexible electronics. As a result, they play an extremely important role in promoting the development of stretchable and wearable electronics. Furthermore, 5G technology and Internet of Things (IoT) technology are expected to contribute to dramatic changes in the fields of healthcare, environmental monitoring, human–machine interface, and energy conversion.

The aims of this Special Issue are to showcase the latest developments in stretchable and wearable electronics, which will cover, but are not limited to, the following categories:

    Flexible electronics;
    Textile-based electronic devices;
    Stretchable supercapacitors;
    Biological and chemical sensors;
    Organic thin-film transistors;
    Photovoltaic cells;
    Flexible logic circuits;
    Flexible photodetectors;
    Actuators;
    Hydrogels.

Dr. Shuye Zhang
Prof. Dr. Wen-Can Huang
Prof. Dr. Baoyang Lu
Dr. Libo Gao
Prof. Dr. Zhenhua Tang
Prof. Dr. Weike Zhang
Dr. Shengxia Li
Dr. Yue Zhang
Dr. Shumi Zhao
Guest Editors

Special Issue on Advances on Ceramic Microsystems
Submission Date: 2022-12-31

Dear Colleagues,

In recent years, ceramic technologies have experienced a renaissance. The growing interest can be observed in the field of developing ceramic-based materials, as well as in the area of their application, such as microwave devices, chemical and biological sensors, integrated circuits, etc. Ceramic-based materials are mostly characterized by the relative simplicity of forming diverse structures, high resistance to harsh environmental conditions and the possibility of integrating such structures with components fabricated by various microelectronic technologies at low cost. Due to the aforementioned advantages, topics well-suited to this paper include, but are not limited to:

1. new trends and achievements in ceramic-based materials;
2. novel microelectronics applications of ceramics;
3. ceramic materials adjusted to microwave applications;
4. microelectronic ceramic sensors;
5. hybrid ceramic-based devices;
6. theoretical and empirical studies of designing, developing and fabricating the ceramic-based microelectronic modules.

Keywords:
- ceramic microsystems
- ceramic fabrication
- LTCC
- ceramic sensors
- Lab-on-Chip
- glass-ceramics
- Integrated ceramic-based modules
- thick-film sensors

For further information, please visit:
https://www.mdpi.com/journal/electronics/special_issues/ceram_microsys

Prof. Dr. Karol Malecha
Dr. Laura Jasinska
Guest Editors

Special Issue on "Recent Advances in AI-Enabled Internet of Things Security and Privacy"
Submission Date: 2022-12-31

Special Issue link: 
https://www.mdpi.com/journal/electronics/special_issues/AI_Iot_Security

Dear Colleagues,

We are experiencing explosive growth in digital data and connected devices today based on the successful realization of the Internet of Things (IoT). The application of artificial intelligence (AI) and machine learning (ML) is prevalent in a wide range of fields. In recent years, AI and ML techniques have been gaining importance as tools to provide intelligence to the IoT. With increased intelligence, the goal of AI-enabled IoT is to provide better heterogeneous connectivity, ubiquitous coverage, reduced network and device complexity, enhanced power savings, and enhanced resource management.

However, due to the deployment of AI-based intelligence for IoT applications, a new set of problems, challenges, risks, and vulnerabilities have been introduced. Thus, it is important to address the challenges provided by intelligent cyberattacks that are targeted towards AI-based IoT.

Prospective authors are invited to submit original manuscripts on topics including, but not limited to:

    Security and privacy issues in intelligent industrial IoT
    Security and privacy issues in intelligent medical IoT
    Security and privacy issues in intelligent smart city IoT
    Security and privacy issues in vehicular IoT
    Security and privacy issues of blockchain technologies for AI-enabled IoT
    Security and privacy issues in intelligent edge network
    Attack models for AI-enabled IoT systems
    Adversarial learning in AI-enabled IoT systems
    AI-based intrusion detection in IoT systems
    Federated learning-based security techniques in intelligent IoT systems
    Experimental testbeds for testing security in AI-enabled IoT systems

Prof. Dr. Insoo Sohn
Prof. Dr. Huaping Liu
Prof. Dr. Tae (Tom) Oh
Guest Editors

Special Issue on Reliable Industry 4.0 Based on Machine Learning and IoT
Submission Date: 2023-01-31

Dear Colleagues,

The fourth industrial revolution, known as Industry 4.0, can provide and integrate many advanced technologies for automation so as to contribute to the operational efficiency and effectiveness of production processes, particularly, the process of combining smart machines and systems. The key technologies of Industry 4.0 are cyber-physical systems, Internet of things (IoT), big data analytics, cloud computing, machine learning, artificial intelligence, visualization, virtual reality, and autonomous robots towards practical applications in many industrial areas. To enhance the reliability of Industry 4.0, researchers from many fields and industries have to work together applying the new technologies in practical applications to provide secure online monitoring and control. This special issue aims to encourage scholars and researchers to present research achievements of state-of-the-art technologies with respect to reliable Industry 4.0 based on machine learning and IoT.

Authors are encouraged to submit papers in any of the following potential topics or related areas of Industry 4.0.

https://www.mdpi.com/journal/electronics/special_issues/Industry_Machine_Learning_IoT

Keywords:
    Cyber-physical systems
    Industrial Internet-of-Things (I-IoT)
    Advanced robotics (collaborative and adaptive robots)
    Additive manufacturing, hybrid manufacturing, and 3D printing
    Smart manufacturing
    Autonomous vehicles and drones
    Industrial big data and data analytics
    Machine learning (ML) and Artificial Intelligence (AI)
    Cloud computing for Industry 4.0
    Augmented reality (AR) and virtual reality (VR) technologies
    Distributed manufacturing
    Planning and scheduling in Industry 4.0
    Energy in Industry 4.0

Dr. Mahmoud Elsisi
Dr. Minh-Quang Tran

Special Issue on Computer-Aided Design for Integrated Circuits and Systems
Submission Date: 2023-01-31

Dear Colleagues,

Currently, we are witnessing a rapid development of semiconductor technology. As a result of the transition from microelectronics to nanoelectronics, new families of VLSI chips have appeared. The modern integrated circuits and systems consist of billions and billions of semiconductor transistors. Now, a single chip is enough to implement very complex digital and mixed digital-analog systems. The stiff competition between the manufacturers of integrated circuits and VLSI systems guarantees that only the best products come to the market. The enormous complexity of modern circuits and systems requires the use of Computer-Aided Design (CAD) tools that automate the different stages of the design flow. Unfortunately, modern CAD tools cannot effectively use all the potential opportunities provided by current integrated circuits. As before, many problems related to the design process still require active human intervention. Therefore, there is an obvious need to improve the theory and practice in circuit design automation in order to provide solutions to these problems. To sum up, the ever-increasing complexity of current and future industrial projects requires the development of efficient CAD tools that facilitate the implementation of complex integrated circuits and systems.

The aim of this Special Issue is to present novel practical and theoretical approaches related to the CAD of integrated circuits and systems. In particular, methodologies, tools, algorithms, and architectures that allow improving the efficiency of integrated circuits and systems in terms of performance, area occupancy, or power consumption are welcome.

Topics of interest of this Special Issue include, but are not limited to, the following:

· Theory of Computer-Aided Design;
· Design methods for reliable and high-efficient (in speed, power consumption or area) integrated circuits and systems;
· Formal methods for System-Level Design;
· Energy-efficient integrated circuits and systems;  
· Design flow for ASICs and programmable devices (FPGAs and CPLDs);
· Synthesis of synchronous/asynchronous digital systems;
· Benchmarking in circuit design automation;
· Design for testability;
· Design, implementation, and verification of Finite State Machines;
· Packing and technology mapping;
· Verification and simulation of digital integrated circuits and systems;
· HW/SW co-design;
· · Design exploration;
· CAD for embedded systems;
· CAD for Cyber-Physical Systems;
· CAD for networking systems;
· Reconfigurable computing.

Guest Editors
Prof. Dr. Alexander Barkalov
Prof. Dr. Larysa Titarenko
Prof. Dr. Raouf Senhadji-Navarro

Special Issue Link:
https://www.mdpi.com/journal/electronics/special_issues/CAD_Circuits_System

Special Issue on Mini-LED, Micro-LED and OLED Displays: Present Status and Future Perspectives
Submission Date: 2023-01-31

Submission deadline: 2023-01-31

Dear Colleagues,

Display technologies have become integral parts of our everyday lives. Their applications cover from smartphones, televisions, cars, and watches to emergent augmented reality and virtual reality. Mini-LED, OLED and Micro-LED are the three next-generation display technologies that have escalated from the research and development phase and have now materialized into commercial products. Despite their similarity in name, they are actually quite different technologically and backed by different display manufacturers. Several technological and scientific efforts have continuously been made to provide better display products.

These three technologies have revolutionized the display world, and each one has different advantages and disadvantages in terms of contrast ratio, resolution density, color gamut, viewing angle, power consumption and the asking price.

This Special Issue is in the scope of optoelectronics and flexible electronics and it welcomes theoretical and experimental studies related to the emerging Mini-LED, OLED and Micro-LED display technologies and highlight the current status of this emissive displays. The capability of these technologies to realize monolithic and heterogeneous devices and their integration in transparent/flexible support to be used in “see-through” applications will be addressed. This issue also covers the light generation mechanisms based on the structure–property relationships and on the size-dependent power efficiency.  This Special Issue will also deal with more general aspects such as the synthesis of new materials, the engineering of new device architectures and realization, the photophysical and photoelectric characteristics. Submitted manuscripts should address one or more of the following themes, although other relevant topics will also be considered:

    The path for OLED in displays;   
    Thin film OLED encapsulation;     
    Efficient material based OLED development;        
    Light extraction;       
    Micro-LED array and growth techniques;        
    Micro-LED arrays on flexible substrates;        
    Color conversion techniques;        
    GaN LED monolithic integration for lighting and displays;        
    Internal Quantum Efficiency of µ-led device;        
    Mini‐LED full-color displays;        
    Mini-LED and µ-LED displays pixel circuit design;        
    Next generation display technologies.

Prof. Dr. Alexis Fischer
Dr. Mahmoud Chakaroun
Guest Editors