Journal Information

Neuroelectronics

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Publisher:
ELSP
ISSN:
3006-1032
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Call For Papers

Neuroelectronics is an academic journal published by ELSP. (ISSN 3006-1032).

Neuroelectronics is a peer-reviewed open-access journal in the fields of neural interfaces technologies and neuroelectronic systems. The journal aims to foster the understanding, development, and application of neurotechnologies by providing a platform for researchers, scientists, engineers, and clinicians to share their original research articles, reviews, perspectives, and letters. Neuroelectronics encourages cross-disciplinary work that bridges neuroscience, engineering, materials science, computational modeling, and clinical applications. The journal covers a wide range of topics related to neuroelectronics, including but not limited to: Neuroprosthetics and Neuroprostheses, neuroelectronic-based devices including the design and implementation of implantable devices for restoring sensory, motor, and cognitive functions, integration of neural interfaces with prosthetic limbs, cochlear implants, retinal implants, and other assistive technologies, as well as exploration of biocompatible materials for tissues’ interfaces and systems’ coatings for long-term implant stability and safe operation. Wearable Brain-Computer Interface (BCI) includes advances in monitoring and recording electroencephalography (EEG) and functional near-infrared spectroscopy (fNIRS), real-time feedback control and training paradigms for neurofeedback-based applications. Neural signal processing and analysis including statistical and machine learning techniques for decoding neural activity and understanding brain states, data fusion and integration methods for multi-modal neural recordings, as well as massively parallel multidimentional neuralsignal processing. Neurostimulationn and neuromodulation techniques and therapeutic applications, encompassing electrical, magnetic and opticstimulations methods such as deep brain stimulation (DBS), transcranial magnetic stimulation (TMS), optogenetics and various neuromodulation approaches, the applications of various neurostimulation techniques. Neuroimaging techniques including advancements in high-resolution imaging such as Photoacoustics, functional magnetic resonance imaging (fMRI) and positron emission tomography (PET), as well as novel neuroimaging modalities for studying brain structure, connectivity, and dynamics. Neural tissues – electronics interfacing techniques including advancements in multi-electrode arrays, high-resolution neural interconnection methods, single neural cell electrode, as well as novel non metallic 2D and 3D neural microelectrode arrays.
Last updated by Dou Sun in

Special Issues

Special Issue on Silicon-Based Probes for Invasive Brain-Computer Interfaces: Engineering Innovations and Clinical Translation Submission Date: 2026-06-30 We invite you to contribute to our upcoming Special Issue on “Silicon-Based Probes for Invasive Brain–Computer Interfaces: Engineering Innovations and Clinical Translation.” This Special Issue aims to highlight the latest breakthroughs in silicon-based neural probe technologies that are transforming invasive brain–computer interfaces (iBCIs) from laboratory research into clinical applications. iBCIs offer a high-precision platform for neural restoration, disease treatment, and the advancement of brain function research. Silicon-based probes have become a cornerstone technology in this field owing to their high-density integration, robust structural stability, and versatility in multi-functional applications. This Special Issue seeks original research and comprehensive reviews that explore the engineering foundations, material innovations, fabrication techniques, multifunctional applications and clinical translation of silicon-based probes. We particularly encourage contributions addressing the challenges and solutions that enable high-density and high-resolution neural recording, long-term stability, flexible packaging and interconnect technologies, and clinical translation and human trials. Submissions may focus on, but are not limited to, topics such as: 1. High-Density Neural Recording Technologies Design and optimization of high-density electrode arrays for neural recording Signal processing algorithms for decoding large-scale neural data Case studies of simultaneous neural recordings from multiple brain regions 2. Long-Term Stability and Packaging/Interconnect Technologies Flexible and biocompatible packaging materials High-reliability interconnects and wireless transmission solutions Accelerated aging tests and reliability assessment 3. Clinical Translation and Human Trials Probe design and validation conforming to medical device standards Outcomes and findings from human clinical trials Safety and biocompatibility assessment of long-term implantation 4. Innovative Materials and System Integration Flexible and silicon-based hybrid structures for neural interfaces Silicon-based neuromorphic electronics Stretchable electronics for neural interface Surface biofunctionalization Closed-loop neuromodulation systems
Last updated by Dou Sun in

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