Conference Information

SenSys 2027: ACM/IEEE Conference on Embedded Artificial Intelligence and Sensing Systems

Please Login to view website of conference
Free account: view official websites, track deadlines, and get email reminders.
Register Login
Embed deadline badge
SenSys
Get this via API
Search and ranking lists need no credentials at all; full detail for this page needs a free API key. See the developer guide.
Submission Date:
2026-10-29 Due in 28 days
Notification Date:
2027-01-28
Conference Date:
2027-05-17
Location:
Boulder, Colorado, USA
Years:
CCF: B   QUALIS: A1   Viewed: 75999   Tracked: 90   Attend: 12

Conference Partner Index (CP-I)

93.0 / 100
Ranked #30 of 5,689 conferences · Top 1%

#4 of 741 in Artificial Intelligence & Machine Learning #6 of 341 in Systems & Architecture

Academic recognition (35%)
100
Submission selectivity (20%)
93
Editions held (20%)
88
Community attention (10%)
68
Public record completeness (15%)
100

Inputs used: Listed as CCF B, QUALIS A1 · Acceptance rate: 17.6% (mean of 5 editions on file) · Editions on record: 25 · Researchers following it here: 90 · Researchers who opened this page in the past 24 months: 24

Confidence 100% - the share of the score backed by observed data rather than the neutral baseline. How this score is calculated · Browse the ranking · Algorithm version 1.1 · Computed 2026-10-01

Call For Papers

SenSys 2027 (ACM/IEEE Conference on Embedded Artificial Intelligence and Sensing Systems) is a CCF B / QUALIS A1 conference held in Boulder, Colorado, USA on 2027-05-17. The paper submission deadline is 2026-10-29. Acceptance notifications are sent on 2027-01-28.

We are pleased to announce SenSys 2027: The International Conference on Embedded Artificial Intelligence and Sensing Systems, co-located with CPS-IoT Week. In 2026, SenSys, IPSN, and IoTDI merged into a single flagship conference, uniting their communities to create the premier forum for research on sensing systems and embedded artificial intelligence (AI). The combined event brings together expertise across sensor networks, embedded systems, mobile and wireless computing, machine learning, cyber-physical systems (CPS), Internet of Things (IoT), and AI-driven applications—fostering new directions and cross-disciplinary impact. SenSys 2027 will continue this tradition. Accepted regular papers will be published with ACM; accepted demo and poster abstracts will be published with IEEE. All content will be cross-indexed. Topics of Interest SenSys 2027 welcomes submissions on original, high-impact research across embedded AI, sensing systems, and CPS/IoT. Topics include, but are not limited to: Algorithms and Information Analytical and theoretical foundations for embedded sensing systems Coding, compression, and information theory for embedded systems Collaborative sensing with AI/ML-driven models Federated learning or neural architecture search (NAS) Large language models for edge and embedded systems Processing in sensor networks and embedded systems Applications Augmented and virtual reality Autonomous vehicles, unmanned aerial vehicles, and drones Personal, wearable, and other human-centric embedded systems Smart cities, smart buildings, and industrial IoT Platforms Low-power and novel IoT protocols for 5G/6G and other architectures New communication paradigms for ubiquitous connectivity Satellite systems and applications, including CubeSats Systems for extreme environments (e.g., underwater, aerial, space) Security Decentralization and blockchain for embedded sensing systems Fairness, equity, and transparency issues in IoT and CPS Fault-tolerance, dependability, and robustness in embedded platforms IoT data marketplaces, compression, and semantic summarization Secure and privacy-sensitive IoT Systems Digital twins and physical AI systems for real-world applications Edge computing, fog computing, and real-time IoT/CPS systems Heterogeneous sensor networks and data fusion IoT and CPS for sustainability Localization, synchronization, RFID, and RF sensing Novel sensor technologies, sensing paradigms, and deployments In addition, SenSys 2027 will accept submissions as a full or short paper on Visions, Experiences, Tools, Datasets, and Benchmarks: Visions, grand challenges, or new directions Experiences, insights, challenges, and lessons learned from real-world deployments Benchmarks for evaluating systems, models, algorithms, or tools Tools, toolkits, or frameworks that advance research in embedded AI and sensing systems Datasets that support research in embedded AI and sensing systems Frameworks that advance research in embedded AI and sensing systems Authors submitting to the second category on visions, experiences, etc., may choose between a full paper (12 pages) or a short paper (6 pages). Short papers will be evaluated on originality, clarity, and potential impact, even without extensive evaluation. Note that survey and tutorial papers are out of scope for SenSys 2027. All accepted papers will be presented at the conference, and their presentation format will be determined later.
Last updated by Admin Agent on

Acceptance Ratio

Average acceptance rate: 17.4% over 10 years (2003–2017).

YearSubmittedAcceptedAccepted(%)
20171512617.2%
20111232419.5%
20101452517.2%
20091192117.6%
20081532516.3%
20071492516.8%
20061222419.7%
20051182117.8%
20041452114.5%
20031372417.5%

Best Papers

People who viewed this also viewed

Related Conferences

CCFICORECP-IShortFull NameSubmissionConference
41.0Artificial IntelligenceInternational Conference on Automation and Artificial Intelligence2022-06-012020-05-21
BA*89.7ICRAInternational Conference on Robotics and Automation2026-09-152027-05-24
BA*94.1IJCAIInternational Joint Conference on Artificial Intelligence2026-01-312026-08-15
B91.2ICASSPInternational Conference on Acoustics, Speech and Signal Processing2026-09-162027-05-16
BA*79.6PODSACM SIGMOD Conference on Principles of DB Systems2026-12-032027-06-13
BA76.5ICMEInternational Conference on Multimedia and Expo2025-12-312026-07-05
B84.4BIBMInternational Conference on Bioinformatics & Biomedicine2026-07-052026-12-01
BA*94.1ICDMInternational Conference on Data Mining2026-06-062026-11-12
BA*89.0ECCVEuropean Conference on Computer Vision2026-03-062026-09-08
BA92.9DATEDesign, Automation and Test in Europe2026-09-072027-03-22

Related Journals

CCFFull NameImpact FactorPublisherISSN
Sensing and Bio-Sensing Research4.9Elsevier2214-1804
Design Automation for Embedded Systems0.9Springer0929-5585
BSoftware & Systems Modeling3.2Springer1619-1366
BPattern Recognition7.6Elsevier0031-3203
BIEEE Transactions on Neural Networks and Learning Systems8.9IEEE1045-9227
BInformation Sciences6.0Elsevier0020-0255
BComputer Networks4.7Elsevier1389-1286
BComputers & Security5.4Elsevier0167-4048
BIEEE Transactions on Intelligent Transportation Systems8.4IEEE1524-9050
BJournal of Systems and Software3.8Elsevier0164-1212

Comments 0

No comments yet.

Please Login to post a comment