Información de la conferencia

SenSys 2027: ACM/IEEE Conference on Embedded Artificial Intelligence and Sensing Systems

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Día de Entrega:
2026-10-29 Faltan 12 días
Fecha de Notificación:
2027-01-28
Fecha de conferencia:
2027-05-17
Ubicación:
Boulder, Colorado, USA
Ediciones:
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CCF: B   QUALIS: A1   Vistas: 76897   Seguidores: 91   Asistentes: 12
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Índice Conference Partner (CP-I)

93,5 / 100
Puesto n.º 30 de 5.721 congresos · 1% superior

N.º 4 de 743 en Inteligencia artificial y aprendizaje automático N.º 7 de 341 en Sistemas y arquitectura

Reconocimiento académico (35%)
100
Selectividad en la revisión (20%)
93
Ediciones celebradas (20%)
88
Atención de la comunidad (10%)
73
Integridad del registro público (15%)
100

Datos utilizados: Categorías: CCF B, QUALIS A1 · Tasa de aceptación: 17.6% (media de 5 ediciones registradas) · Ediciones documentadas: 25 · Investigadores que lo siguen aquí: 91 · Investigadores que abrieron esta página en los últimos 24 meses: 47

Confianza 100 %: la parte de la puntuación respaldada por datos observados y no por la línea base neutra. Cómo se calcula esta puntuación · Ver la clasificación · Versión del algoritmo 1.2 · Calculado el 2026-10-17

Solicitud de Artículos

SenSys 2027 (ACM/IEEE Conference on Embedded Artificial Intelligence and Sensing Systems) is a CCF B / QUALIS A1 conference held in Boulder, Colorado, USA on 2027-05-17. The paper submission deadline is 2026-10-29. Acceptance notifications are sent on 2027-01-28.

We are pleased to announce SenSys 2027: The International Conference on Embedded Artificial Intelligence and Sensing Systems, co-located with CPS-IoT Week. In 2026, SenSys, IPSN, and IoTDI merged into a single flagship conference, uniting their communities to create the premier forum for research on sensing systems and embedded artificial intelligence (AI). The combined event brings together expertise across sensor networks, embedded systems, mobile and wireless computing, machine learning, cyber-physical systems (CPS), Internet of Things (IoT), and AI-driven applications—fostering new directions and cross-disciplinary impact. SenSys 2027 will continue this tradition. Accepted regular papers will be published with ACM; accepted demo and poster abstracts will be published with IEEE. All content will be cross-indexed. Topics of Interest SenSys 2027 welcomes submissions on original, high-impact research across embedded AI, sensing systems, and CPS/IoT. Topics include, but are not limited to: Algorithms and Information Analytical and theoretical foundations for embedded sensing systems Coding, compression, and information theory for embedded systems Collaborative sensing with AI/ML-driven models Federated learning or neural architecture search (NAS) Large language models for edge and embedded systems Processing in sensor networks and embedded systems Applications Augmented and virtual reality Autonomous vehicles, unmanned aerial vehicles, and drones Personal, wearable, and other human-centric embedded systems Smart cities, smart buildings, and industrial IoT Platforms Low-power and novel IoT protocols for 5G/6G and other architectures New communication paradigms for ubiquitous connectivity Satellite systems and applications, including CubeSats Systems for extreme environments (e.g., underwater, aerial, space) Security Decentralization and blockchain for embedded sensing systems Fairness, equity, and transparency issues in IoT and CPS Fault-tolerance, dependability, and robustness in embedded platforms IoT data marketplaces, compression, and semantic summarization Secure and privacy-sensitive IoT Systems Digital twins and physical AI systems for real-world applications Edge computing, fog computing, and real-time IoT/CPS systems Heterogeneous sensor networks and data fusion IoT and CPS for sustainability Localization, synchronization, RFID, and RF sensing Novel sensor technologies, sensing paradigms, and deployments In addition, SenSys 2027 will accept submissions as a full or short paper on Visions, Experiences, Tools, Datasets, and Benchmarks: Visions, grand challenges, or new directions Experiences, insights, challenges, and lessons learned from real-world deployments Benchmarks for evaluating systems, models, algorithms, or tools Tools, toolkits, or frameworks that advance research in embedded AI and sensing systems Datasets that support research in embedded AI and sensing systems Frameworks that advance research in embedded AI and sensing systems Authors submitting to the second category on visions, experiences, etc., may choose between a full paper (12 pages) or a short paper (6 pages). Short papers will be evaluated on originality, clarity, and potential impact, even without extensive evaluation. Note that survey and tutorial papers are out of scope for SenSys 2027. All accepted papers will be presented at the conference, and their presentation format will be determined later.
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Tasa de aceptación

Tasa de aceptación media: 17.4% en 10 años (2003–2017).

AñoEnviadosAceptadosAceptados(%)
20171512617.2%
20111232419.5%
20101452517.2%
20091192117.6%
20081532516.3%
20071492516.8%
20061222419.7%
20051182117.8%
20041452114.5%
20031372417.5%

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Revistas Relacionadas

CCFNombre CompletoFactor de ImpactoEditorISSN
CEngineering Applications of Artificial Intelligence9.0Elsevier0952-1976
BComputer Networks4.7Elsevier1389-1286
Sensing and Bio-Sensing Research4.9Elsevier2214-1804
Design Automation for Embedded Systems0.9Springer0929-5585
BSoftware & Systems Modeling3.2Springer1619-1366
BPattern Recognition7.6Elsevier0031-3203
BIEEE Transactions on Neural Networks and Learning Systems8.9IEEE1045-9227
BInformation Sciences6.0Elsevier0020-0255
BComputers & Security5.4Elsevier0167-4048
BIEEE Transactions on Intelligent Transportation Systems8.4IEEE1524-9050

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