Conference Information

ICSICT 2026: International Conference on Solid-State and Integrated Circuit Technology

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ICSICT
Submission Date:
2026-06-25
Notification Date:
2026-07-25
Conference Date:
2026-10-27
Location:
Hangzhou, China
Years:
18
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Call For Papers

ICSICT 2026 (International Conference on Solid-State and Integrated Circuit Technology) is an academic conference held in Hangzhou, China on 2026-10-27. The paper submission deadline is 2026-06-25. Acceptance notifications are sent on 2026-07-25.

Conference Scope: The following are the technical tracks and research directions of ICSICT 2026 (paper submissions are solicited in, but not limited to the following areas) Theme 1: Digital & System Level IC Track 1：Digital Architectures & Systems FPGA Circuits Design & Application Processors, Accelerators & SoCs Memory System & Process in Memory System Level Testability & Reliability Track 2：Digital Circuits Digital Blocks Logical/Physical-Level Security Non-volatile Memory & Volatile Memory Circuit Level Reliability Design Track 3：Design Methodology & EDA Design for Testability, Reliability & Manufacturability Modeling，Simulation & Emulation Design & Technology Co-Optimization Artificial Intelligence Algorithms for EDA Theme 2: Analog Track 4：RF & Wireless Building Blocks at RF, mm-wave and THz Rx, Tx or TRx for Wireless Systems Wireless Sensor, Radar, Imager Device/Packaging/Modeling at RF, mm-wave and THz Track 5：Wireline Electrical/Optical Transmitters/Receivers for Wireline Clock Generation and Distribution Circuits Building Blocks for High-Speed Wireline Communications Track 6：General Analog Advanced Analog Circuits High-Speed, High-Precision Data Converters Imagers, Medical Devices & Display Systems Efficient Power Management Circuits Theme 3: Devices Track 7：CMOS Logic Devices & Sensors Advanced CMOS Logic Devices 2D & Thin Film Devices & Technologies Flash & Non-Volatile & 3D Memory Technologies Sensor, Sensing Microsystem, MEMS, and Bioelectronics Smart/Intelligent Sensors & Actuators Device Modeling & Simulation Track 8：Power Devices & Power IC Silicon-based Power Devices Wide Bandgap Power Devices Power Integrated Circuits、modules & Systems Power Integrating & Packaging Technology Power Device Reliability Power Device Modeling & Simulation Track 9：Device Reliability & Security Back-End of Line Reliability & ESD Aging & Remaining Useful Lifetime Prediction PUF & Hardware Security Devices Radiation Reliability Theme 4: Process & Technologies Track 10：Semiconductor Process Technologies Compound Semiconductor Materials & Technologies Advanced Memory Materials & Technologies Advanced Process Technologies Advanced Interconnect Technologies Process Modeling & Simulation Track 11：Optoelectronics and Silicon Photonics Integration High-Speed Optoelectronic Devices Silicon Photonics & Integration Photonic Sensors & Image Sensors Optical Computing Devices Display Process & Integration Track 12：Packaging Technologies 2.5D & 3D Integration Heterogeneous Integration Packaging Advanced Wire Bonding Technology Modeling and Simulation for Advanced Packaging Testing and Reliability in Advanced Packaging
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