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ICSICT 2026: International Conference on Solid-State and Integrated Circuit Technology

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截稿日期:
2026-06-25
通知日期:
2026-07-25
会议日期:
2026-10-27
会议地点:
Hangzhou, China
届数:
18
浏览: 3752   关注: 0   参加: 0

会伴指数 (CP-I)

50.2 / 100
全站第 1,566 名 / 共 5,693 个会议 · 前 28%

电气与电子工程 第 91 / 511

学术认可 (35%) 无数据 —— 按中性基准 50 分计入 —
投稿选择性 (20%) 无数据 —— 按中性基准 50 分计入 —
会议传承 (20%)
79
社区关注 (10%)
16
资料公开度 (15%)
35

用到的输入: 有据可查的届次：18 · 过去 24 个月打开过本页的研究者：7 人

公开资料里还缺: 历年录用率 (+4.5) · 历届信息 (+3.0) · 最佳论文记录 (+2.3)
主办方认领本会议后，可直接在这一页补上；分数每晚重算。如何提升这个分数

置信度 45% —— 分数中有多大比例来自实际观测到的数据，而不是中性基准。 这个分数是怎么算出来的 · 查看完整榜单 · 算法版本 1.1 · 算于 2026-10-05

征稿

ICSICT 2026 (International Conference on Solid-State and Integrated Circuit Technology) is an academic conference held in Hangzhou, China on 2026-10-27. The paper submission deadline is 2026-06-25. Acceptance notifications are sent on 2026-07-25.

Conference Scope: The following are the technical tracks and research directions of ICSICT 2026 (paper submissions are solicited in, but not limited to the following areas) Theme 1: Digital & System Level IC Track 1：Digital Architectures & Systems FPGA Circuits Design & Application Processors, Accelerators & SoCs Memory System & Process in Memory System Level Testability & Reliability Track 2：Digital Circuits Digital Blocks Logical/Physical-Level Security Non-volatile Memory & Volatile Memory Circuit Level Reliability Design Track 3：Design Methodology & EDA Design for Testability, Reliability & Manufacturability Modeling，Simulation & Emulation Design & Technology Co-Optimization Artificial Intelligence Algorithms for EDA Theme 2: Analog Track 4：RF & Wireless Building Blocks at RF, mm-wave and THz Rx, Tx or TRx for Wireless Systems Wireless Sensor, Radar, Imager Device/Packaging/Modeling at RF, mm-wave and THz Track 5：Wireline Electrical/Optical Transmitters/Receivers for Wireline Clock Generation and Distribution Circuits Building Blocks for High-Speed Wireline Communications Track 6：General Analog Advanced Analog Circuits High-Speed, High-Precision Data Converters Imagers, Medical Devices & Display Systems Efficient Power Management Circuits Theme 3: Devices Track 7：CMOS Logic Devices & Sensors Advanced CMOS Logic Devices 2D & Thin Film Devices & Technologies Flash & Non-Volatile & 3D Memory Technologies Sensor, Sensing Microsystem, MEMS, and Bioelectronics Smart/Intelligent Sensors & Actuators Device Modeling & Simulation Track 8：Power Devices & Power IC Silicon-based Power Devices Wide Bandgap Power Devices Power Integrated Circuits、modules & Systems Power Integrating & Packaging Technology Power Device Reliability Power Device Modeling & Simulation Track 9：Device Reliability & Security Back-End of Line Reliability & ESD Aging & Remaining Useful Lifetime Prediction PUF & Hardware Security Devices Radiation Reliability Theme 4: Process & Technologies Track 10：Semiconductor Process Technologies Compound Semiconductor Materials & Technologies Advanced Memory Materials & Technologies Advanced Process Technologies Advanced Interconnect Technologies Process Modeling & Simulation Track 11：Optoelectronics and Silicon Photonics Integration High-Speed Optoelectronic Devices Silicon Photonics & Integration Photonic Sensors & Image Sensors Optical Computing Devices Display Process & Integration Track 12：Packaging Technologies 2.5D & 3D Integration Heterogeneous Integration Packaging Advanced Wire Bonding Technology Modeling and Simulation for Advanced Packaging Testing and Reliability in Advanced Packaging
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