Conference Information

ICSICT 2026: International Conference on Solid-State and Integrated Circuit Technology

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Submission Date:
2026-06-25
Notification Date:
2026-07-25
Conference Date:
2026-10-27
Location:
Hangzhou, China
Years:
18
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ICSICT
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Conference Partner Index (CP-I)

50.2 / 100
Ranked #1,566 of 5,693 conferences · Top 28%

#91 of 511 in Electrical & Electronic Engineering

Academic recognition (35%) No data - scored at the neutral baseline of 50 —
Submission selectivity (20%) No data - scored at the neutral baseline of 50 —
Editions held (20%)
79
Community attention (10%)
16
Public record completeness (15%)
35

Inputs used: Editions on record: 18 · Researchers who opened this page in the past 24 months: 7

Missing from the public record: Historical acceptance rates (+4.5) · Past editions (+3.0) · Best-paper records (+2.3)
Organizers can add these from this page after claiming the conference; scores are recomputed nightly. How to raise this score

Confidence 45% - the share of the score backed by observed data rather than the neutral baseline. How this score is calculated · Browse the ranking · Algorithm version 1.1 · Computed 2026-10-05

Call For Papers

ICSICT 2026 (International Conference on Solid-State and Integrated Circuit Technology) is an academic conference held in Hangzhou, China on 2026-10-27. The paper submission deadline is 2026-06-25. Acceptance notifications are sent on 2026-07-25.

Conference Scope: The following are the technical tracks and research directions of ICSICT 2026 (paper submissions are solicited in, but not limited to the following areas) Theme 1: Digital & System Level IC Track 1:Digital Architectures & Systems FPGA Circuits Design & Application Processors, Accelerators & SoCs Memory System & Process in Memory System Level Testability & Reliability Track 2:Digital Circuits Digital Blocks Logical/Physical-Level Security Non-volatile Memory & Volatile Memory Circuit Level Reliability Design Track 3:Design Methodology & EDA Design for Testability, Reliability & Manufacturability Modeling,Simulation & Emulation Design & Technology Co-Optimization Artificial Intelligence Algorithms for EDA Theme 2: Analog Track 4:RF & Wireless Building Blocks at RF, mm-wave and THz Rx, Tx or TRx for Wireless Systems Wireless Sensor, Radar, Imager Device/Packaging/Modeling at RF, mm-wave and THz Track 5:Wireline Electrical/Optical Transmitters/Receivers for Wireline Clock Generation and Distribution Circuits Building Blocks for High-Speed Wireline Communications Track 6:General Analog Advanced Analog Circuits High-Speed, High-Precision Data Converters Imagers, Medical Devices & Display Systems Efficient Power Management Circuits Theme 3: Devices Track 7:CMOS Logic Devices & Sensors Advanced CMOS Logic Devices 2D & Thin Film Devices & Technologies Flash & Non-Volatile & 3D Memory Technologies Sensor, Sensing Microsystem, MEMS, and Bioelectronics Smart/Intelligent Sensors & Actuators Device Modeling & Simulation Track 8:Power Devices & Power IC Silicon-based Power Devices Wide Bandgap Power Devices Power Integrated Circuits、modules & Systems Power Integrating & Packaging Technology Power Device Reliability Power Device Modeling & Simulation Track 9:Device Reliability & Security Back-End of Line Reliability & ESD Aging & Remaining Useful Lifetime Prediction PUF & Hardware Security Devices Radiation Reliability Theme 4: Process & Technologies Track 10:Semiconductor Process Technologies Compound Semiconductor Materials & Technologies Advanced Memory Materials & Technologies Advanced Process Technologies Advanced Interconnect Technologies Process Modeling & Simulation Track 11:Optoelectronics and Silicon Photonics Integration High-Speed Optoelectronic Devices Silicon Photonics & Integration Photonic Sensors & Image Sensors Optical Computing Devices Display Process & Integration Track 12:Packaging Technologies 2.5D & 3D Integration Heterogeneous Integration Packaging Advanced Wire Bonding Technology Modeling and Simulation for Advanced Packaging Testing and Reliability in Advanced Packaging
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