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ICSICT 2026: International Conference on Solid-State and Integrated Circuit Technology

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ICSICT
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투고 마감일:
2026-06-25
통보일:
2026-07-25
개최일:
2026-10-27
개최지:
Hangzhou, China
개최 횟수:
18
조회: 3750   팔로우: 0   참가: 0

회반 지수 (CP-I)

50.2 / 100
전체 5,693개 중 1,566위 · 상위 28%

전기·전자공학 분야 511개 중 91위

학술적 인정 (35%) 데이터 없음 — 중립 기준값 50점으로 계산 —
투고 선별성 (20%) 데이터 없음 — 중립 기준값 50점으로 계산 —
개최 횟수 (20%)
79
커뮤니티 관심도 (10%)
16
공개 자료 충실도 (15%)
35

사용한 입력: 확인되는 개최 횟수: 18 · 지난 24개월 동안 이 페이지를 연 연구자: 7명

공개 자료에서 빠진 항목: 역대 게재율 (+4.5) · 역대 회차 (+3.0) · 최우수 논문 기록 (+2.3)
주최자는 학회를 인증 신청한 뒤 이 페이지에서 바로 추가할 수 있습니다. 점수는 매일 밤 다시 계산됩니다. 이 점수를 올리는 방법

신뢰도 45% — 점수 중 중립 기준값이 아니라 실제 관측된 데이터에 근거한 비율. 이 점수는 어떻게 계산되나 · 전체 순위 보기 · 알고리즘 버전 1.1 · 산출일 2026-10-05

논문 모집

ICSICT 2026 (International Conference on Solid-State and Integrated Circuit Technology) is an academic conference held in Hangzhou, China on 2026-10-27. The paper submission deadline is 2026-06-25. Acceptance notifications are sent on 2026-07-25.

Conference Scope: The following are the technical tracks and research directions of ICSICT 2026 (paper submissions are solicited in, but not limited to the following areas) Theme 1: Digital & System Level IC Track 1：Digital Architectures & Systems FPGA Circuits Design & Application Processors, Accelerators & SoCs Memory System & Process in Memory System Level Testability & Reliability Track 2：Digital Circuits Digital Blocks Logical/Physical-Level Security Non-volatile Memory & Volatile Memory Circuit Level Reliability Design Track 3：Design Methodology & EDA Design for Testability, Reliability & Manufacturability Modeling，Simulation & Emulation Design & Technology Co-Optimization Artificial Intelligence Algorithms for EDA Theme 2: Analog Track 4：RF & Wireless Building Blocks at RF, mm-wave and THz Rx, Tx or TRx for Wireless Systems Wireless Sensor, Radar, Imager Device/Packaging/Modeling at RF, mm-wave and THz Track 5：Wireline Electrical/Optical Transmitters/Receivers for Wireline Clock Generation and Distribution Circuits Building Blocks for High-Speed Wireline Communications Track 6：General Analog Advanced Analog Circuits High-Speed, High-Precision Data Converters Imagers, Medical Devices & Display Systems Efficient Power Management Circuits Theme 3: Devices Track 7：CMOS Logic Devices & Sensors Advanced CMOS Logic Devices 2D & Thin Film Devices & Technologies Flash & Non-Volatile & 3D Memory Technologies Sensor, Sensing Microsystem, MEMS, and Bioelectronics Smart/Intelligent Sensors & Actuators Device Modeling & Simulation Track 8：Power Devices & Power IC Silicon-based Power Devices Wide Bandgap Power Devices Power Integrated Circuits、modules & Systems Power Integrating & Packaging Technology Power Device Reliability Power Device Modeling & Simulation Track 9：Device Reliability & Security Back-End of Line Reliability & ESD Aging & Remaining Useful Lifetime Prediction PUF & Hardware Security Devices Radiation Reliability Theme 4: Process & Technologies Track 10：Semiconductor Process Technologies Compound Semiconductor Materials & Technologies Advanced Memory Materials & Technologies Advanced Process Technologies Advanced Interconnect Technologies Process Modeling & Simulation Track 11：Optoelectronics and Silicon Photonics Integration High-Speed Optoelectronic Devices Silicon Photonics & Integration Photonic Sensors & Image Sensors Optical Computing Devices Display Process & Integration Track 12：Packaging Technologies 2.5D & 3D Integration Heterogeneous Integration Packaging Advanced Wire Bonding Technology Modeling and Simulation for Advanced Packaging Testing and Reliability in Advanced Packaging
최종 수정: Dou Sun ()

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