Conference Information

CICC 2027: IEEE Custom Integrated Circuits Conference

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Submission Date:
2026-11-16 Due in 14 days
Notification Date:
Conference Date:
2027-04-18
Location:
San Diego, California, USA
Years:
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QUALIS: B2   Viewed: 26983   Tracked: 6   Attend: 0
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CICC
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Conference Partner Index (CP-I)

49.1 / 100
Ranked #1,925 of 5,764 conferences · Top 34%

#123 of 520 in Electrical & Electronic Engineering

Academic recognition (35%)
68
Submission selectivity (20%) No data - scored at the neutral baseline of 50 —
Editions held (20%)
19
Community attention (10%)
33
Public record completeness (15%)
55

Inputs used: Listed as QUALIS B2 · Editions on record: 1 · Researchers following it here: 6 · Researchers who opened this page in the past 24 months: 6

Missing from the public record: Historical acceptance rates (+4.5) · Best-paper records (+2.3)
Organizers can add these from this page after claiming the conference; scores are recomputed nightly. How to raise this score

Confidence 80% - the share of the score backed by observed data rather than the neutral baseline. How this score is calculated · Browse the ranking · Algorithm version 1.2 · Computed 2026-11-02

Call For Papers

CICC 2027 (IEEE Custom Integrated Circuits Conference) is a QUALIS B2 conference held in San Diego, California, USA on 2027-04-18. The paper submission deadline is 2026-11-16.

Submission of original unpublished work in following areas: Analog Circuits and Techniques encompass circuits characterized by analog-dominated innovation, featuring building blocks such as amplifiers, comparators, frequency generation (oscillators and PLL) and clocking circuits, dividers, filters, references, nonlinear signal processing circuits, digitally-assisted analog circuits, sensor interface circuits. Biomedical Technologies and Applications focus on biomedical circuits, systems, and applications including but not limited to neural interfaces, microarrays, lab-on-a-chip, bio-inspired circuits, implantable and/or wearable systems, neuromodulation, electroceuticals, closed-loop systems with sensing and actuation, medical imaging, biotelemetry systems, bio-energy harvesting/scavenging systems, body area sensor networks for wireless health monitoring, biomedical signal processing SoCs, AI/ML techniques for mixed-signal biomedical applications, brain computer interfaces, and other biosensors. Data Converters include a range of innovative converters, such as Nyquist and oversampled A/D, D/A, time-to-digital, frequency-to-digital, and analog-to-information converters of all types driven by innovative techniques, architectures, technologies or applications. Digital Circuits welcome papers with IC prototypes in technologies that enhance the efficiency, performance, reliability, or integrity of integrated systems. Areas of interest include but are not limited to processors, accelerators, interconnect fabrics, communication SoCs, memory, and in-memory computing. Foundational hardware design building blocks, and associated techniques to demonstrate novel circuits in relevant technology nodes are encouraged. Holistic innovations such as hardware-software codesign, advancement in cloud and edge computing, and autonomy are also of interest. Advanced and Emerging Technologies solicit hardware-focused papers exploring the technologies of tomorrow spanning from new devices and circuits to advanced applications. Topics of interest include next-generation technology for MEMS, THz, flexible, printed, large-area, and organic electronics, as well as emerging computing paradigms such as photonic and quantum computing hardware. Systems and Security seek papers on the latest advancements in system and platform design as well as hardware security. For the security category, contributions are invited on topics covering innovative security primitives, circuit-level attack/defense mechanisms, and approaches to secure system designs. Relevant topics on system platforms include large-scale SoCs and FPGA-based designs, large-scale RISC-V platforms and neuromorphic platforms. Papers related to novel work on chiplets like 2.5D/3D chiplets, system-in-package (SiP), system-on-interposer, novel methodologies and EDA for system and platform design, test, packaging, power and thermal and cross-disciplinary approaches bridging design, manufacturing, and system integration will be selected for a special session with the CHISIC Design Workshop. Power Management solicit circuits and design techniques in areas including switched-mode integrated converters with inductive, capacitive, and hybrid architectures, 3D power delivery for high performance computing and chiplets, energy harvesting, wireless power transfer, isolated power, power management for automotive applications. Relevant topics also include linear regulators and digital LDOs, circuit with novel wide-bandgap devices and drivers, battery chargers, supply modulators, and innovative methods to enhance overall system energy efficiency and performance. Wireless Transceivers and RF/mm-Wave Circuits and Systems cover applications from IoT and cellular (5G, LTE-M, NB-IoT) to vehicle-to-vehicle (V2V), WLAN, THz systems, and integrated sensing-communication systems. Papers should focus on low-power, high-performance links, design-technology co-optimization, agile spectrum management, AI/ML-assisted designs, novel RF front-ends, frequency synthesis, and LO generation. Wireline and Optical Communication Circuits and Systems welcome papers on serial/parallel data links for intra-chip/chip-to-chip/die-to-die interconnections, memory/graphics interfaces, backplanes, silicon-photonics optical communications, 2.5/3D interconnects, and chiplet-based packaging solutions. Additionally papers on novel I/O circuits, signaling methods, CDRs, equalizers, ADC/DAC/DSP-based transceivers, and electro-optical interface circuitry for pluggable and co-packaged optics are of interest.
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