Conference Information

BMSAI 2022: International Conference on Biometrics, Microelectronic Sensors and Artificial Intelligence

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BMSAI
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Submission Date:
2022-03-20 Extended
Notification Date:
Conference Date:
2022-03-25
Location:
Sanya, China
Years:
1
Viewed: 9253   Tracked: 0   Attend: 0

Conference Partner Index (CP-I)

35.8 / 100
Ranked #5,622 of 5,693 conferences · Top 99%

#246 of 246 in Computer Vision & Pattern Recognition #509 of 511 in Electrical & Electronic Engineering #730 of 742 in Artificial Intelligence & Machine Learning

Academic recognition (35%) No data - scored at the neutral baseline of 50 —
Submission selectivity (20%) No data - scored at the neutral baseline of 50 —
Editions held (20%)
19
Community attention (10%)
8
Public record completeness (15%)
25

Inputs used: Editions on record: 1 · Researchers who opened this page in the past 24 months: 2

Missing from the public record: Historical acceptance rates (+4.5) · Past editions (+3.0) · Best-paper records (+2.3)
Organizers can add these from this page after claiming the conference; scores are recomputed nightly. How to raise this score

Confidence 45% - the share of the score backed by observed data rather than the neutral baseline. How this score is calculated · Browse the ranking · Algorithm version 1.1 · Computed 2026-10-05

Call For Papers

BMSAI 2022 (International Conference on Biometrics, Microelectronic Sensors and Artificial Intelligence) is an academic conference held in Sanya, China on 2022-03-25. The paper submission deadline is 2022-03-20 (extended).

2022 International Conference on Biometrics, Microelectronic Sensors and Artificial Intelligence (BMSAI 2022)  will bring together leading researchers, engineers and scientists in the domain of interest from around the world. 
 Topics of interest for submission include, but are not limited to: 
 Machinery and production technology Fingerprint recognition, vein recognition and other applications Biometric acquisition device Evaluation and enhancement of biometric signal quality Biometric-based emotional computing Identification and processing of other biometrics Multimodal biometrics and information fusion Biometric database construction and synthesis Large-scale biometric identification systems Biometric system anti-counterfeiting and security Biometric system evaluation and application 
 Microelectronic sensors Research and development of new devices and processes Advanced system packaging and 3D integration Integrated circuit equipment materials Digital integrated circuits and systems Analog/RF circuits and systems Memory architecture and design New computing architecture chip design Open source chips and agile development Reliability technology and measurable design IoT and smart sensor design Healthcare and intelligent terminal design Preparation of new materials Chemical sensors and electrochemical sensors Optical sensors and biosensors Electrobiochemilumine sensors and biosensors Sensor membrane or nanosensor Novel sensor concepts and new quantitative methods 
 Artificial intelligence Machine learning Natural language processing Intelligent robot Artificial Intelligence Modeling and Simulation Pervasive computing and environmental intelligence Automatic control Build product/system lifecycle datasets with AI Ai-enabled modeling and design of materials, metamaterials, and material systems Computer Vision and Speech Understanding Data mining and machine learning tools Artificial Intelligence applied to the Internet of Things (IoT) Ai-aided design of mechanisms and other mechanical systems Heuristics and AI planning strategies and tools Hybrid intelligent system Multimedia and Cognitive Informatics Mechatronics
Last updated by Dou Sun on

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