Conference Information
HOT CHIPS 2017 : Symposium on High Performance Chips
Submission Date:
2017-04-07 Extended
Notification Date:
Conference Date:
Cupertino, California, USA
CCF: b   CORE: a   Viewed: 9832   Tracked: 9   Attend: 2

Conference Location
Call For Papers
Areas of Interest:

    General-Purpose Processor Chips
        High Performance and Low Power
        Multi-Core, Highly-Reliable Systems
    Mobile and Embedded Devices
        SoC, Security, and DSP Chips
    Communications and Networking
        Wireless LAN/WAN/PAN
        Network and IO Processors
    Emerging Computation Architectures
        Machine Learning, Vision and Graphics/Compute Engines
        Data Analytics and Big Data processing
        IoT and Always-On Functions
    Other Chips
        FPGAs and FPGA-Based Systems
        Custom Chips for Emerging Applications
        Open-Source Chips
    Other Technologies
        Power and Thermal Management
            Packaging and Testing
        Display Technologies
            On-Chip Optics & Sensors
            Novel Computing Technologies
    Memory Technologies
        Persistent Memory, Phase Change
        Packaging, 3D, Stacked
    Software for Multi-core, Heterogeneous Systems
        Programming models, Runtime systems
        Performance, Power Debug and Evaluation

Submission Guidelines

Submissions must consist of the following:

    “Presentation” or “Poster”
    Extended abstract (two pages maximum)
    Presenter’s contact information (name, affiliation, job title, address, phone(s), fax, and email)
    Indication whether you have submitted, intend to submit, or have already presented or published a similar or overlapping submission to another conference or journal.
    Indication if you would like the submission to be held confidential.

Evaluation Critieria

Regular presentation and poster submissions are evaluated by the Program Committee on the basis of: performance of the device(s), degree of innovation, use of advanced technology, potential market significance and anticipated interest to the audience. Both regular presentation slides and posters are published in the Hot Chips proceedings.

Presentation Guidelines

Presentations at HOT CHIPS are in the form of 30 minute talks using PowerPoint or PDF. Presentation slides will be published in the HOT CHIPS Proceedings. Participants are not required to submit written papers, but a select group will be invited to submit a paper for inclusion in a special issue of IEEE Micro.

Poster Guidelines

Poster submissions are also accepted from both industry and academia and consist of 4 slides with a one- page summary. In particular, student posters describing applied research performed at a university are encouraged. The most outstanding student poster will receive the Best Student Poster Award.
Last updated by Dou Sun in 2017-03-26
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