Conference Information
HOT CHIPS 2020: Symposium on High Performance Chips
Submission Date:
Notification Date:
Conference Date:
Palo Alto, California, USA
CCF: b   CORE: a   Viewed: 14896   Tracked: 14   Attend: 2

Conference Location
Call For Papers
Areas of Interest:

    General-Purpose Processor Chips
        High Performance and Low Power
        Multi-Core, Highly-Reliable Systems
    Mobile and Embedded Devices
        SoC, Security, and DSP Chips
    Communications and Networking
        Wireless LAN/WAN/PAN
        Network and IO Processors
    Emerging Computation Architectures
        Machine Learning, Vision and Graphics/Compute Engines
        Data Analytics and Big Data processing
        IoT and Always-On Functions
        Neuromorphic and Quantum Computing
    Other Chips
        FPGAs and FPGA-Based Systems
        Custom Chips for Emerging Applications
        Open-Source Chips
    Other Technologies
        Power and Thermal Management
        Packaging and Testing
        Display Technologies
        On-Chip Optics & Sensors
        Novel Computing Technologies
    Memory Technologies
        Persistent Memory, Phase Change
        Packaging, 3D, Stacked
    Software for Multi-core, Heterogeneous Systems
        Programming models, Runtime systems
        Performance, Power Debug and Evaluation

Submission Guidelines

Submissions must consist of the following:

    “Presentation” or “Poster”
    Extended abstract (two pages maximum)
    Presenter’s contact information (name, affiliation, job title, address, phone(s), fax, and email)
    Indication whether you have submitted, intend to submit, or have already presented or published a similar or overlapping submission to another conference or journal.
    Indication if you would like the submission to be held confidential.

Evaluation Critieria

Regular presentation and poster submissions are evaluated by the Program Committee on the basis of: performance of the device(s), degree of innovation, use of advanced technology, potential market significance and anticipated interest to the audience. Both regular presentation slides and posters are published in the Hot Chips proceedings.

Presentation Guidelines

Presentations at HOT CHIPS are in the form of 30 minute talks using PowerPoint or PDF. Presentation slides will be published in the HOT CHIPS Proceedings. Participants are not required to submit written papers, but a select group will be invited to submit a paper for inclusion in a special issue of IEEE Micro.

Poster Guidelines

Poster submissions are also accepted from both industry and academia and consist of 4 slides with a one- page summary. In particular, student posters describing applied research performed at a university are encouraged. The most outstanding student poster will receive the Best Student Poster Award.
Last updated by Dou Sun in 2020-02-13
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Related Journals
CCFFull NameImpact FactorPublisherISSN
Journal of Building Performance Simulation3.110Taylor & Francis1940-1493
bPerformance Evaluation1.689Elsevier0166-5316
ACM Transactions on Modeling and Performance Evaluation of Computing SystemsACM2376-3639
Computing and Informatics Institute of Informatics, Slovakia1335-9150
Journal of Universal Computer Science0.546Verlag der Technischen Universitat Graz0948-695x
Brain InformaticsSpringer2198-4018
IEEE Transactions on Signal Processing5.230IEEE1053-587X
cSignal Processing: Image Communication2.814Elsevier0923-5965
cImage and Vision Computing2.747Elsevier0262-8856
International Journal of Performability Engineering RAMS Consultants0973-1318
Full NameImpact FactorPublisher
Journal of Building Performance Simulation3.110Taylor & Francis
Performance Evaluation1.689Elsevier
ACM Transactions on Modeling and Performance Evaluation of Computing SystemsACM
Computing and Informatics Institute of Informatics, Slovakia
Journal of Universal Computer Science0.546Verlag der Technischen Universitat Graz
Brain InformaticsSpringer
IEEE Transactions on Signal Processing5.230IEEE
Signal Processing: Image Communication2.814Elsevier
Image and Vision Computing2.747Elsevier
International Journal of Performability Engineering RAMS Consultants