Conference Information

HotI 2026: IEEE Symposium on High-Performance Interconnects, Hot Interconnects

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Submission Date:
2026-05-20 Extended
Notification Date:
2026-06-26
Conference Date:
2026-08-19
Location:
Online
Years:
33
CCF: C   QUALIS: B2   Viewed: 41343   Tracked: 31   Attend: 5

Call For Papers

HotI 2026 (IEEE Symposium on High-Performance Interconnects, Hot Interconnects) is a CCF C / QUALIS B2 conference held in Online on 2026-08-19. The paper submission deadline is 2026-05-20 (extended). Acceptance notifications are sent on 2026-06-26.

Topics of Interest Systems software for communication Novel and innovative interconnect architectures Accelerator interconnects, e.g. NVLINK, Infinity Fabric Network software/hardware designed for AI/ML workloads Multi-core processor interconnects System-on-Chip Interconnects Chiplet-interconnect technologies such as UCIe and BOW Advanced chip-to-chip communication technologies Optical interconnects Protocol and interfaces for inter-processor communication Survivability and fault-tolerance of interconnects High-speed packet processing engines and network processors System and storage area network architectures and protocols High-performance host-network interface architectures High-bandwidth and low-latency I/O Pb/s switching and routing technologies Innovative architectures for supporting collective communication Novel communication architectures to support cloud & grid computing Centralized and distributed cloud interconnects Requirements driving high-performance interconnects Traffic characterization for HPC systems and commercial data centers Software-defined networking and software overlay networks Software for network bring-up, configuration and performance management (OpenFlow, OpenSM) Data Center Networking
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