Conference Information
Hot Interconnects 2024: Symposium on High-Performance Interconnects
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CCF: c   QUALIS: b2   Viewed: 23796   Tracked: 26   Attend: 4

Call For Papers
Topics of Interests

    Novel and innovative interconnect architectures
    Accelerator interconnects, e.g. NVLINK, Infinity Fabric
    Network software/hardware designed for AI/ML workloads
    Multi-core processor interconnects
    System-on-Chip Interconnects
    Chiplet-interconnect technologies such as UCIe and BOW
    Advanced chip-to-chip communication technologies
    Optical interconnects
    Protocol and interfaces for inter-processor communication
    Survivability and fault-tolerance of inter-connects
    High-speed packet processing engines and network processors
    Systems software for communication
    System and storage area network architectures and protocols
    High-performance host-network interface architectures
    High-bandwidth and low-latency I/O
    Pb/s switching and routing technologies
    Innovative architectures for supporting collective communication
    Novel communication architectures to support cloud & grid computing
    Centralized and distributed cloud interconnects
    Requirements driving high-performance interconnects
    Traffic characterization for HPC systems and commercial data centers
    Software-defined networking and software overlay networks
    Software for network bring-up, configuration and performance management (OpenFlow, OpenSM)
    Data Center Networking
Last updated by Dou Sun in 2024-04-06
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