会議情報
Hot Interconnects 2022: Symposium on High-Performance Interconnects
https://hoti.org/提出日: |
2022-05-06 |
通知日: |
2022-06-20 |
会議日: |
2022-08-17 |
場所: |
Online |
年: |
29 |
CCF: c QUALIS: b2 閲覧: 23614 追跡: 26 出席: 4
論文募集
Topics In past year’s the best papers on interconnect microarchitecture have been invited to submit extended versions of their papers to special journal editions, we are pursuing this once again this year. Selected papers from last year’s Hot Interconnects are being published in the a special Hot Interconnects issue of IEEE Micro. Hot Interconnects is the premier international forum for researchers and developers of state-of-the-art hardware and software architectures and implementations for interconnection networks of all scales, ranging from multi-core on-chip interconnects to those within systems, clusters, data centers, and clouds. This yearly conference is attended by leaders in industry and academia. The atmosphere provides for a wealth of opportunities to interact with individuals at the forefront of this field. Themes include cross-cutting issues spanning computer systems, networking technologies, and communication protocols for high-performance interconnection networks. This conference is directed particularly at new and exciting technology and product innovations in these areas. Contributions should focus on real experimental systems, prototypes, or leading-edge products and their performance evaluation. We invite paper submissions across a wide range of topics and levels, ranging from fundamentals to the latest advances in hot topic areas. Topics of Interests Novel and innovative interconnect architectures Multi-core processor interconnects System-on-Chip Interconnects Advanced chip-to-chip communication technologies Optical interconnects Protocol and interfaces for inter-processor communication Survivability and fault-tolerance of inter-connects High-speed packet processing engines and network processors Systems software for communication System and storage area network architectures and protocols High-performance host-network interface architectures High-bandwidth and low-latency I/O Pb/s switching and routing technologies Innovative architectures for supporting collective communication Novel communication architectures to support cloud & grid computing Centralized and distributed cloud interconnects Requirements driving high-performance interconnects Traffic characterization for HPC systems and commercial data centers Software-defined networking and software overlay networks Software for network bring-up, configuration and performance management (OpenFlow, OpenSM) Data Center Networking
最終更新 Dou Sun 2022-04-09
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関連仕訳帳
CCF | 完全な名前 | インパクト ・ ファクター | 出版社 | ISSN |
---|---|---|---|---|
b | Performance Evaluation | 1.987 | Elsevier | 0166-5316 |
Telematics and Informatics Reports | Elsevier | 2772-5030 | ||
Journal of Building Performance Simulation | 3.110 | Taylor & Francis | 1940-1493 | |
b | International Journal of Human-Computer Interaction | 1.26 | Taylor & Francis | 1044-7318 |
a | ACM Transactions on Computer-Human Interaction | ACM | 1073-0516 | |
Future Internet | MDPI | 1999-5903 | ||
b | Human–Computer Interaction | Taylor & Francis | 0737-0024 | |
Brain-Computer Interfaces | Taylor & Francis | 2326-263X | ||
International Journal of Child-Computer Interaction | Elsevier | 2212-8689 | ||
International Journal of Performability Engineering | RAMS Consultants | 0973-1318 |
完全な名前 | インパクト ・ ファクター | 出版社 |
---|---|---|
Performance Evaluation | 1.987 | Elsevier |
Telematics and Informatics Reports | Elsevier | |
Journal of Building Performance Simulation | 3.110 | Taylor & Francis |
International Journal of Human-Computer Interaction | 1.26 | Taylor & Francis |
ACM Transactions on Computer-Human Interaction | ACM | |
Future Internet | MDPI | |
Human–Computer Interaction | Taylor & Francis | |
Brain-Computer Interfaces | Taylor & Francis | |
International Journal of Child-Computer Interaction | Elsevier | |
International Journal of Performability Engineering | RAMS Consultants |
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