Conference Information
COOL Chips 2027: IEEE Symposium on Low-Power and High-Speed Chips and Systems
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Conference Partner Index (CP-I)
| Academic recognition (35%) | No data - scored at the neutral baseline of 50 | — |
| Submission selectivity (20%) | No data - scored at the neutral baseline of 50 | — |
| Editions held (20%) |
|
92 |
| Community attention (10%) |
|
17 |
| Public record completeness (15%) |
|
55 |
Inputs used: Editions on record: 30 · Researchers following it here: 1 · Researchers who opened this page in the past 24 months: 3
Missing from the public record:
Historical acceptance rates (+4.5) · Best-paper records (+2.3)
Organizers can add these from this page after claiming the conference; scores are recomputed nightly. How to raise this score
Confidence 45% - the share of the score backed by observed data rather than the neutral baseline. How this score is calculated · Browse the ranking · Algorithm version 1.1 · Computed 2026-10-04
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Create a free account and we will email you 30, 14, 7, 3, 1 days before the submission deadline.
Your first reminder would be sent on 2027-01-06.
Call For Papers
COOL Chips 2027 (IEEE Symposium on Low-Power and High-Speed Chips and Systems) is an academic conference held in Tokyo, Japan on 2027-04-14. The paper submission deadline is 2027-02-05. Acceptance notifications are sent on 2027-03-12.
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Related Journals
| CCF | Full Name | Impact Factor | Publisher | ISSN |
|---|---|---|---|---|
| A | IEEE Transactions on Multimedia | 9.7 | IEEE | 1520-9210 |
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| B | Software & Systems Modeling | 3.2 | Springer | 1619-1366 |
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| B | Pattern Recognition | 7.6 | Elsevier | 0031-3203 |
| IEEE Access | 3.6 | IEEE | 2169-3536 | |
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