会议信息
EMSOFT 2024: International Conference on Embedded Software
https://esweek.org/emsoft/
截稿日期:
2024-03-24
通知日期:
2024-07-14
会议日期:
2024-09-29
会议地点:
Raleigh, North Carolina, USA
届数:
24
CCF: b   CORE: a   QUALIS: a2   浏览: 37683   关注: 31   参加: 8

征稿
EMSOFT (ACM SIGBED International Conference on Embedded Software) aims at advancing the science and engineering of embedded software. Since 2001, EMSOFT has been at the forefront of embedded software innovation, connecting academia, industry, and government. At EMSOFT, cutting-edge research meets practical application in designing and analyzing software that brings the digital and physical worlds together. EMSOFT’s tradition is at the heart of cyber-physical systems, where computation, networking, and physical dynamics converge.

We invite submissions on all aspects of embedded software systems, including but not limited to:

    Embedded distributed, networked systems
        Time-critical embedded systems;
        Multi-/many-core processors, hardware accelerators;
        Embedded operating systems and middleware;
        Scheduling, resource allocation, and execution time analysis;
        QoS management and performance analysis;
        Hardware and software co-design.
    Embedded software design and analysis
        Energy-efficient embedded software;
        Safety/Mixed-critical embedded software;
        Software design and analysis for cyber-physical systems;
        Embedded software architectures for data-intensive applications and signal processing.
    Cyber-security, safety, and resilience
        Embedded software security and privacy;
        Safety mechanisms and methods for embedded software;
        Robust implementation of control systems.
    Process and methods
        Formal modeling and verification;
        Testing, validation, and certification;
        Model- and component-based approaches;
    Empirical studies and their reproduction
    Sustainability and energy sobriety
    Application areas including automotive, avionics, energy, health care, mobile devices, multimedia, machine learning, and autonomous systems
最后更新 Dou Sun 在 2024-03-07
录取率
时间提交数录取数录取率(%)
2006943133%
2005882528.4%
20041183025.4%
2003602033.3%
2002441738.6%
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相关期刊
CCF全称影响因子出版商ISSN
IEEE Software2.589IEEE0740-7459
SoftwareX1.959Elsevier2352-7110
bJournal of Systems and Software2.829Elsevier0164-1212
bThe Journal of Systems Architecture: Embedded Software Design5.836Elsevier1383-7621
Environmental Modelling & Software5.288Elsevier1364-8152
bACM Transactions on Embedded Computing Systems ACM1539-9087
bAutomated Software Engineering1.273Springer0928-8910
bACM Transactions on Mathematical SoftwareACM0098-3500
Advances in Engineering Software4.141Elsevier0965-9978
Optimization Methods and Software1.336Taylor & Francis1055-6788
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