会议信息

EMSOFT 2026: International Conference on Embedded Software

请登录查看会议网址

截稿日期:
2026-03-23
通知日期:
2026-07-17
会议日期:
2026-10-04
会议地点:
Barcelona, Spain
届数:
26
CCF: b   CORE: a   QUALIS: a2   浏览: 72660   关注: 35   参加: 10

征稿

EMSOFT 2026 (International Conference on Embedded Software ) is a CCF B / CORE A / QUALIS A2 conference held in Barcelona, Spain on 2026-10-04. The paper submission deadline is 2026-03-23. Acceptance notifications are sent on 2026-07-17.

EMSOFT (ACM SIGBED International Conference on Embedded Software) aims at advancing the science and engineering of embedded software. Since 2001, EMSOFT has been at the forefront of embedded software innovation, connecting academia, industry, and government. At EMSOFT, cutting-edge research meets practical application in designing and analyzing software that brings the digital and physical worlds together. EMSOFT’s tradition is at the heart of cyber-physical systems, where computation, networking, and physical dynamics converge. We invite submissions on all aspects of embedded software systems, including but not limited to: Embedded distributed, networked systems Time-critical embedded systems Multi-/many-core processors, hardware accelerators Embedded operating systems and middleware Scheduling, resource allocation, and execution time analysis QoS management and performance analysis Hardware and software co-design Embedded software design and analysis Energy-efficient embedded software Safety/Mixed-critical embedded software Software design and analysis for cyber-physical systems Embedded software architectures for data-intensive applications and signal processing Cyber-security, safety, resilience and fault-tolerance Embedded software security and privacy Embedded software safety Robust implementation of control systems Processes and methods Formal modeling and verification Testing, validation, and certification Model- and component-based approaches Empirical studies and their reproduction Sustainability and energy optimization Application areas including automotive, avionics, energy, health care, mobile devices, multimedia, machine learning, and autonomous systems
最后更新 Dou Sun 在

录取率

Average acceptance rate: 31.8% over 5 years (2002–2006).

时间提交数录取数录取率(%)
2006943133%
2005882528.4%
20041183025.4%
2003602033.3%
2002441738.6%

最佳论文

相关会议

CCFCOREQUALIS简称全称截稿日期通知日期会议日期
bba1ICRAInternational Conference on Robotics and Automation2025-09-152026-06-01
bba1ICASSPInternational Conference on Acoustics, Speech and Signal Processing2025-09-172026-01-162026-05-04
ba*a1PODSACM SIGMOD Conference on Principles of DB Systems2026-12-032027-03-012027-06-13
bba1ICMEInternational Conference on Multimedia and Expo2025-12-312026-03-132026-07-05
bb4BIBMInternational Conference on Bioinformatics & Biomedicine2026-07-052026-09-252026-12-01
ba*a1ICDMInternational Conference on Data Mining2026-06-062026-08-162026-11-12
baa1ECCVEuropean Conference on Computer Vision2026-03-062026-05-092026-09-08
bba1DATEDesign, Automation and Test in Europe2025-09-152025-11-192026-04-20
ba*a1SIGMETRICSInternational Conference on Measurement and Modeling of Computer Systems2026-01-062026-03-132026-06-08
baa2ECML-PKDDThe European Conference on Machine Learning and Principles and Practice of Knowledge Discovery in Databases2025-03-072025-05-262025-09-15

相关期刊

CCF全称影响因子出版商ISSN
bIEEE Transactions on Multimedia9.7IEEE1520-9210
bSoftware & Systems Modeling3.2Springer1619-1366
bPattern Recognition7.6Elsevier0031-3203
bIEEE Transactions on Neural Networks and Learning Systems8.9IEEE1045-9227
bInformation Sciences6.8Elsevier0020-0255
bComputer Networks4.6Elsevier1389-1286
bComputers & Security5.4Elsevier0167-4048
bIEEE Transactions on Intelligent Transportation Systems8.4IEEE1524-9050
bJournal of Systems and Software4.1Elsevier0164-1212
bIEEE Transactions on Robotics10.5IEEE1552-3098

惊喜