会议信息

ATS 2026: Asian Test Symposium

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截稿日期:
2026-06-06 已截稿
通知日期:
2026-09-14
会议日期:
2026-12-01
会议地点:
Kaohsiung City, Taiwan
届数:
35
CCF: C   浏览: 35484   关注: 18   参加: 1
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会伴指数 (CP-I)

63.0 / 100
全站第 512 名 / 共 5,759 个会议 · 前 9%

系统与体系结构 第 86 / 341

学术认可 (35%)
66
投稿选择性 (20%) 无数据 —— 按中性基准 50 分计入 —
会议传承 (20%)
96
社区关注 (10%)
53
资料公开度 (15%)
35

用到的输入: 收录等级：CCF C · 有据可查的届次：35 · 在会伴关注它的研究者：18 人 · 过去 24 个月打开过本页的研究者：27 人

公开资料里还缺: 历年录用率 (+4.5) · 历届信息 (+3.0) · 最佳论文记录 (+2.3)
主办方认领本会议后，可直接在这一页补上；分数每晚重算。如何提升这个分数

置信度 80% —— 分数中有多大比例来自实际观测到的数据，而不是中性基准。 这个分数是怎么算出来的 · 查看完整榜单 · 算法版本 1.2 · 算于 2026-10-25

征稿

ATS 2026 (Asian Test Symposium) is a CCF C conference held in Kaohsiung City, Taiwan on 2026-12-01. The paper submission deadline is 2026-06-06. Acceptance notifications are sent on 2026-09-14.

Topics — Original papers on, but not limited to, the following areas are invited: AI test and Test for AI Analog/Mixed-Signal Test ATE Design Automatic Test Pattern Generation (ATPG) Autonomous Testing Board-Level Testing and Diagnosis Boundary Scan Test Built-In Self-Test (BIST) CPU/GPU Test Connectivity Testing Defect-Based Test Delay and Performance Test Dependability and Functional Safety Design Verification, Validation, and Debug Design for Testability (DFT) Diagnosis and Silicon Debug Fault Diagnosis and Failure Analysis Fault Modeling and Simulation Fault Tolerance Hardware Oriented Security and Trust High-Speed I/O Test Heterogeneous Testing Low-Power IC Test Machine Learning in Test Memory Test, Diagnosis, and Repair Multi-/Many-core Processor Test Online Test On-Chip Measurement Power/Thermal/Reliability Issues in Test Reconfigurable System Test Reliability and Testing for Emerging/Approximate/Quantum Computing RF Test Safety and Test for Automotive ICs Self-Repair SiP, Chiplet, 2.5D and 3D IC Test Software Test and Reliability Standards in Test System-on-Chip Test Test Compression Test Economics Test Quality Test Synthesis Test for Biomedical Circuits and Systems Test for MEMS and Microfluidic Systems Test for Nanoscale Devices and Emerging Technologies Test for Reversible and Quantum Circuits Test for Sensors and IoT Yield Analysis, Learning, and Enhancement
由 Dou Sun 最后更新于

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