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IC-ICTES 2017: International Conference on Information and Communication Technology for Embedded Systems

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IC-ICTES
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Submission Date:
2017-02-06 Extended
Notification Date:
2017-03-06
Conference Date:
2017-05-07
Location:
Chonburi, Thailand
Years:
8
Viewed: 20242   Tracked: 1   Attend: 0

Conference Partner Index (CP-I)

44.6 / 100
Ranked #2,945 of 5,682 conferences · Top 52%

#231 of 341 in Systems & Architecture #451 of 864 in Networks & Communications

Academic recognition (35%) No data - scored at the neutral baseline of 50 —
Submission selectivity (20%) No data - scored at the neutral baseline of 50 —
Editions held (20%)
59
Community attention (10%)
15
Public record completeness (15%)
25

Inputs used: Editions on record: 8 · Researchers following it here: 1 · Researchers who opened this page in the past 24 months: 2

Missing from the public record: Historical acceptance rates (+4.5) · Past editions (+3.0) · Best-paper records (+2.3)
Organizers can add these from this page after claiming the conference; scores are recomputed nightly. How to raise this score

Confidence 45% - the share of the score backed by observed data rather than the neutral baseline. How this score is calculated · Browse the ranking · Algorithm version 1.1 · Computed 2026-09-15

Call For Papers

IC-ICTES 2017 (International Conference on Information and Communication Technology for Embedded Systems) is an academic conference held in Chonburi, Thailand on 2017-05-07. The paper submission deadline is 2017-02-06 (extended). Acceptance notifications are sent on 2017-03-06.

The conference calls for research papers reporting original investigation results of research and devel- opment on real embedded system applications and their system development. Topics in IC-ICTES 2017 are listed below, but not limited to: A. Embedded system architecture: Multiprocessors, reconfigurable platforms, memory management support, communication, protocols, network-on-chip, real-time systems, embedded microcontrollers. B. Real-time systems: All real-time related aspects such as software, distributed real-time systems, real-time kernels, real-time OS, task scheduling, multitasking design. C. Embedded hardware support: System-on-a-chip, DSPs, hardware specification, synthesis, modeling, simulation and analysis at all levels for low power, power-aware, testable, reliable, verifiable systems, performance modeling, validation, security issues, real-time behavior and safety critical systems. D. Embedded software: Compilers, assemblers and cross assemblers, programming, memory man- agement, object-oriented aspects, virtual machines, scheduling, concurrent software for SoCs, distributed/resource aware OS, OS and middleware support. E. Hardware/software co-design: Methodologies, test and debug strategies, real-time systems, speci- fication and modeling, design representation, synthesis, partitioning, estimation, design space explo- ration beyond traditional hardware/software boundary and algorithms. F. Testing techniques: All aspects of testing, including design-for-test, test synthesis, built-in self-test, embedded test, for embedded and system-on-a-chip systems. G. Application-specific processors and devices: Network processors, real-time processor, media and signal processors, application specific hardware accelerators, reconfigurable processors, low power embedded processors, bio/fluidic processors, Bluetooth, hand-held devices, _ash memory chips. H. Industrial practices and benchmark suites: System design, processor design, software, tools, case studies, trends, emerging technologies, experience maintaining benchmark suites, representation, interchange format, tools, copyrights, maintenance, metrics. I. Embedded computing education: Curriculum issues, teaching tools and methods. J. Emerging new topics: New challenges for next generation embedded computing systems, arising from new technologies (e.g., nanotechnology), new applications (e.g., pervasive or ubiquitous com- puting, embedded internet tools) and new principle (e.g., embedded Engineering). K. Embedded System Applications: All ranges of applications on embedded system, including speech processing, image processing, network computing, distributed computing, parallel computing and power conversion. L. Automotive Engineering: Automotive design, new challenges on development of autoparts and automatives, safety engineering, fuel economy/emissions, vehicle dynamics, NVH engineering, auto- motive performance, shift quality, durability/corrosion engineering, package/ergonimics engineering, climate control, derivability, program timing, assembly feasibility, automotive embedded systems.
Last updated by Dou Sun on

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