IC-ICTES 2017 (International Conference on Information and Communication Technology for Embedded Systems) is an academic conference held in Chonburi, Thailand on 2017-05-07. The paper submission deadline is 2017-02-06 (extended). Acceptance notifications are sent on 2017-03-06.
The conference calls for research papers reporting original investigation results of research and devel- opment on real embedded system applications and their system development. Topics in IC-ICTES 2017 are listed below, but not limited to:
A. Embedded system architecture: Multiprocessors, reconfigurable platforms, memory management support, communication, protocols, network-on-chip, real-time systems, embedded microcontrollers.
B. Real-time systems: All real-time related aspects such as software, distributed real-time systems, real-time kernels, real-time OS, task scheduling, multitasking design.
C. Embedded hardware support: System-on-a-chip, DSPs, hardware specification, synthesis, modeling, simulation and analysis at all levels for low power, power-aware, testable, reliable, verifiable systems, performance modeling, validation, security issues, real-time behavior and safety critical systems.
D. Embedded software: Compilers, assemblers and cross assemblers, programming, memory man- agement, object-oriented aspects, virtual machines, scheduling, concurrent software for SoCs, distributed/resource aware OS, OS and middleware support.
E. Hardware/software co-design: Methodologies, test and debug strategies, real-time systems, speci- fication and modeling, design representation, synthesis, partitioning, estimation, design space explo- ration beyond traditional hardware/software boundary and algorithms.
F. Testing techniques: All aspects of testing, including design-for-test, test synthesis, built-in self-test, embedded test, for embedded and system-on-a-chip systems.
G. Application-specific processors and devices: Network processors, real-time processor, media and signal processors, application specific hardware accelerators, reconfigurable processors, low power embedded processors, bio/fluidic processors, Bluetooth, hand-held devices, _ash memory chips.
H. Industrial practices and benchmark suites: System design, processor design, software, tools, case studies, trends, emerging technologies, experience maintaining benchmark suites, representation, interchange format, tools, copyrights, maintenance, metrics.
I. Embedded computing education: Curriculum issues, teaching tools and methods.
J. Emerging new topics: New challenges for next generation embedded computing systems, arising from new technologies (e.g., nanotechnology), new applications (e.g., pervasive or ubiquitous com- puting, embedded internet tools) and new principle (e.g., embedded Engineering).
K. Embedded System Applications: All ranges of applications on embedded system, including speech processing, image processing, network computing, distributed computing, parallel computing and power conversion.
L. Automotive Engineering: Automotive design, new challenges on development of autoparts and automatives, safety engineering, fuel economy/emissions, vehicle dynamics, NVH engineering, auto- motive performance, shift quality, durability/corrosion engineering, package/ergonimics engineering, climate control, derivability, program timing, assembly feasibility, automotive embedded systems.
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