会议信息

IC-ICTES 2017: International Conference on Information and Communication Technology for Embedded Systems

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截稿日期:
2017-02-06 已截稿
通知日期:
2017-03-06
会议日期:
2017-05-07
会议地点:
Chonburi, Thailand
届数:
8
浏览: 20496   关注: 1   参加: 0
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IC-ICTES
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会伴指数 (CP-I)

44.6 / 100
全站第 3,079 名 / 共 5,763 个会议 · 前 54%

系统与体系结构 第 237 / 341 网络与通信 第 474 / 874

学术认可 (35%) 无数据 —— 按中性基准 50 分计入 —
投稿选择性 (20%) 无数据 —— 按中性基准 50 分计入 —
会议传承 (20%)
59
社区关注 (10%)
15
资料公开度 (15%)
25

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征稿

IC-ICTES 2017 (International Conference on Information and Communication Technology for Embedded Systems) is an academic conference held in Chonburi, Thailand on 2017-05-07. The paper submission deadline is 2017-02-06 (extended). Acceptance notifications are sent on 2017-03-06.

The conference calls for research papers reporting original investigation results of research and devel- opment on real embedded system applications and their system development. Topics in IC-ICTES 2017 are listed below, but not limited to: A. Embedded system architecture: Multiprocessors, reconfigurable platforms, memory management support, communication, protocols, network-on-chip, real-time systems, embedded microcontrollers. B. Real-time systems: All real-time related aspects such as software, distributed real-time systems, real-time kernels, real-time OS, task scheduling, multitasking design. C. Embedded hardware support: System-on-a-chip, DSPs, hardware specification, synthesis, modeling, simulation and analysis at all levels for low power, power-aware, testable, reliable, verifiable systems, performance modeling, validation, security issues, real-time behavior and safety critical systems. D. Embedded software: Compilers, assemblers and cross assemblers, programming, memory man- agement, object-oriented aspects, virtual machines, scheduling, concurrent software for SoCs, distributed/resource aware OS, OS and middleware support. E. Hardware/software co-design: Methodologies, test and debug strategies, real-time systems, speci- fication and modeling, design representation, synthesis, partitioning, estimation, design space explo- ration beyond traditional hardware/software boundary and algorithms. F. Testing techniques: All aspects of testing, including design-for-test, test synthesis, built-in self-test, embedded test, for embedded and system-on-a-chip systems. G. Application-specific processors and devices: Network processors, real-time processor, media and signal processors, application specific hardware accelerators, reconfigurable processors, low power embedded processors, bio/fluidic processors, Bluetooth, hand-held devices, _ash memory chips. H. Industrial practices and benchmark suites: System design, processor design, software, tools, case studies, trends, emerging technologies, experience maintaining benchmark suites, representation, interchange format, tools, copyrights, maintenance, metrics. I. Embedded computing education: Curriculum issues, teaching tools and methods. J. Emerging new topics: New challenges for next generation embedded computing systems, arising from new technologies (e.g., nanotechnology), new applications (e.g., pervasive or ubiquitous com- puting, embedded internet tools) and new principle (e.g., embedded Engineering). K. Embedded System Applications: All ranges of applications on embedded system, including speech processing, image processing, network computing, distributed computing, parallel computing and power conversion. L. Automotive Engineering: Automotive design, new challenges on development of autoparts and automatives, safety engineering, fuel economy/emissions, vehicle dynamics, NVH engineering, auto- motive performance, shift quality, durability/corrosion engineering, package/ergonimics engineering, climate control, derivability, program timing, assembly feasibility, automotive embedded systems.
由 Dou Sun 最后更新于

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