Journal Information

Materials Science in Semiconductor Processing

Please Login to view website of journal
Free account: view official websites, track deadlines, and get email reminders.
Register Login
Get this via API
Search and ranking lists need no credentials at all; full detail for this page needs a free API key. See the developer guide.
Impact Factor:
4.6
Publisher:
Elsevier
ISSN:
1369-8001
Viewed:
9174
Tracked:
0

Call For Papers

Materials Science in Semiconductor Processing is an academic journal published by Elsevier. (ISSN 1369-8001, impact factor 4.6).

Functional Materials for (Opto)electronics, Sensors, Detectors, and Green Energy. Materials Science in Semiconductor Processing provides a unique forum for the discussion of novel processing, applications, and theoretical studies of functional semiconductor materials and devices. Each issue aims to provide a snapshot of current insights, new achievements, breakthroughs, perspectives, and future trends in material sciences for such diverse fields as advanced electronics and opto-electronics, sensors and detectors, energy conversion and storage, communications, biotechnology, (photo)catalysis, nano- and thin-film deposition and growth technology, hybrid and quantum materials, device fabrication technology, and modelling, which are the backbone of advanced semiconductor processing and applications. Coverage will include: advanced lithography, etching, doping, annealing, and thin film processing for submicron and nano devices; material and device failure, reliability, damage evolution, and related issues; advanced chemical and physical vapor deposition; advanced metallization and interconnect schemes; compound semiconductor materials and processing; new dielectrics and non-oxide materials and their applications; (macro)molecular, hybrid, heterostructure, and quantum materials, devices, and processing; molecular dynamics, ab-initio methods, Monte Carlo simulations, data intensive and machine-learning based approaches, etc.; new materials and processes for discrete and integrated circuits; advanced electronic packaging materials and processes; magnetic materials and spintronics; crystal growth technology and mechanism; intrinsic impurities and defects of materials. Pure device simulation and modelling without connection to experiment is not within the aim and scope of this journal.
Last updated by Dou Sun on

Special Issues

Special Issue on Advanced Electronic Packaging and Heterogenous Integration for Future Artificial Intelligence Applications Submission Date: 2026-11-01 Guest editors: Chong Leong Gan, Micron Memory Taiwan Co. Ltd., Taichung, Taiwan Min-Hua Chung, Micron Memory Taiwan Co. Ltd., Taichung, Taiwan Chen-Yu Huang, Micron Memory Taiwan Co. Ltd., Taichung, Taiwan Hong Wan Ng, Micron Semiconductor Asia, Singapore Kuan-Neng Chen, National Yang Ming Chiao Tung University, Hsinchu, Taiwan Special issue information: This special issue aims to provide a platform for both academic and industrial researchers to share their most recent works on the development of semiconductor device processing technologies, heterogenous integration technical challenges and mitigation strategies. Novel and forefront research studies on semiconductor packaging, simulation and modelling, materials innovations as well as testing methodologies to resolve key fabrication and packaging failures are crucial in enabling the next decades of semiconductor advancements for future AI applications. This special issue collects regular and review papers on but not limited to the subjects below. 1. Chip to packaging interactions (CPI), package to silicon integration and study 2. Heterogenous integration in memory and semiconductor devices 3. Materials innovations and characterizations in advanced semiconductor packaging 4. Advanced 3D packaging technologies such as Cu-Cu bonding, hybrid bonding, CuSn bonding technologies in HBM (High Bandwidth Memory) and CoWoS (Chip-on-wafer on Substrate) packaging 5. Quality and reliability assessment in advanced 2.5D and 3D packaging 6. Advanced semiconductor testing methodologies, testing hardware and strategies 7. Novel materials and testing methods for future high performance computing such HBM (High Bandwidth memory), Cryogenic memory applications.8. Packaging process improvements, wafer level integration process challenges, yield mitigations and enhancements 9. Mechanical, thermal and process simulation and modeling in advanced packaging technologies 10. Digital twins and applications in advanced packaging Manuscript submission information: Submission Deadline: 1 November 2026 Submission Site: Editorial Manager® Article Type Name: "VSI: Advanced Packaging" - please select this item when you submit manuscripts online. All manuscripts will be peer-reviewed. Submissions will be evaluated based on originality, significance, technical quality, and clarity. Once accepted, articles will be posted online immediately and published in a journal regular issue within weeks. Articles will also be simultaneously collected in the online special issue. For any inquiries about the appropriateness of contribution topics, welcome to contact the Leading Guest Editor. For more information about our Journal, please visit our ScienceDirect Page: Materials Science in Semiconductor Processing. Keywords: 3D Memory device packaging, High Bandwidth Memory Packaging, Heterogeneous Integration, Materials Innovations and Memory reliability, Materials Innovation
Last updated by Dou Sun on
Special Issue on Advanced Packaging Techniques for Electronics and Optoelectronics Submission Date: 2026-12-31 Packaging plays a critical role in electronic and optoelectronic devices by ensuring their performance, durability, and operational lifespan under practical operating conditions. As electronics and optoelectronics advance toward greater miniaturization, higher integration density, and increased multifunctionality, packaging is increasingly expected to provide capabilities beyond conventional mechanical protection, including thermal management, optical regulation, and electromagnetic shielding. In addition, recent advances in manufacturing techniques—such as additive manufacturing—have also created new opportunities to engineer packaging materials with customized compositional and structural characteristics. These developments position functional packaging as a critical research frontier for next-generation electronic and optoelectronic systems. This special issue aims to highlight recent progress in functional packaging materials and technologies. We invite original research and review articles that advance the state of the art in this interdisciplinary field. Topics of interest include, but are not limited to: Thermal-Management Packaging Optically Functional Coatings Packaging for Extreme Environments Advanced Manufacturing for Electronic Packaging Co-Packaged Optic Chiplet/Dielet related packaging technologies and materials Guest editors: Lyu Zhou Texas Tech University, Lubbock, TX, USA Tiwei Wei University of California, Los Angeles, CA, USA Huamin Li University at Buffalo, The State University of New York, Buffalo, NY, USA Shuang Cui The University of Texas at Dallas, Dallas, TX, USA Ketan Yogi Purdue University, West Lafayette, IN, USA Manuscript submission information: Submission Period: 01 July 2026 - 31 December 2026 Submission Site: Editorial Manager® Article Type Name: "VSI: Functional Packaging" - please select this item when you submit manuscripts online. Submissions will be evaluated based on originality, significance, technical quality, and clarity. Once accepted, articles will be posted online immediately and published in a journal regular issue within weeks. Articles will also be simultaneously collected in the online special issue. For any inquiries about the appropriateness of contribution topics, welcome to contact the Leading Guest Editor. For more information about our Journal, please visit our ScienceDirect Page: Materials Science in Semiconductor Processing. Keywords: Passive thermal management; Selective transmission; Additive manufacturing; Co-packaged optic; Chiplet and Dielet https://www.sciencedirect.com/special-issue/332729/advanced-packaging-techniques-for-electronics-and-optoelectronics
Last updated by Dou Sun on
Special Issue on Emerging Two-Dimensional Semiconductor Materials for Electronic and Optoelectronic Applications Submission Date: 2027-03-31 Two-dimensional (2D) semiconductors have emerged as a transformative materials platform, enabling unprecedented control over electronic, optical, and quantum phenomena at the atomic scale. Beyond graphene, layered materials such as transition metal dichalcogenides, black phosphorus, MXenes, and novel van der Waals heterostructures offer tunable bandgaps, strong light–matter interactions, and excellent mechanical flexibility. This Special Issue aims to highlight recent advances in material synthesis, fundamental physics, device architectures, and system-level integration of 2D semiconductors for next-generation electronic and optoelectronic technologies, bridging laboratory discoveries with practical applications. Potential Topics Include: Synthesis and scalable growth of 2D semiconductors​ Electronic and optoelectronic device physics 2D heterostructures and interface engineering Flexible, wearable, and transparent electronics Photodetectors, light-emitting devices, and energy applications Guest editors: Pankaj Koinkar Tokushima University, Tokushima, Japan Meng-Lin Tsai National Taiwan University of Science and Technology, Taipei City, Taiwan Rungsima Yeetsorn King Mongkut’s University of Technology North Bangkok, Bangkok, Thailand Anas Abdul Latiff Universiti Teknikal Malaysia Melaka (UTeM), Melaka, Malaysia Rakesh Kumar Rajaboina National Institute of Technology (NIT) Warangal, India Manuscript submission information: Submission Deadline: 31 March 2027 Submission Site: Editorial Manager® Article Type Name: "VSI: EDS-2026" - please select this item when you submit manuscripts online. Submissions will be evaluated based on originality, significance, technical quality, and clarity. Once accepted, articles will be posted online immediately and published in a journal regular issue within weeks. Articles will also be simultaneously collected in the online special issue. For any inquiries about the appropriateness of contribution topics, welcome to contact the Leading Guest Editor. For more information about our Journal, please visit our ScienceDirect Page: Materials Science in Semiconductor Processing. Keywords: Two-dimensional semiconductors 2D heterostructures Light–matter interaction in 2D semiconductors Photodetectors and phototransistors Emerging nanoelectronics Flexible and transparent optoelectronics Solar cells and energy-harvesting devices https://www.sciencedirect.com/special-issue/333568/emerging-two-dimensional-semiconductor-materials-for-electronic-and-optoelectronic-applications
Last updated by Dou Sun on

Related Journals

CCFFull NameImpact FactorPublisherISSN
Materials Science and Engineering: B5.7Elsevier0921-5107
Materials Science and Engineering: CElsevier0928-4931
Computational Materials Science3.3Elsevier0927-0256
Journal of Materials Processing Technology7.5Elsevier0924-0136
Materials & Design8.2Elsevier0264-1275
Optical Materials4.2Elsevier0925-3467
Materials Letters2.7Elsevier0167-577X
Materials DiscoveryElsevier2352-9245
Materials Science and Engineering: R: Reports26.8Elsevier0927-796X
Semiconductor Science and Technology2.1IOP Publishing1361-6641

Related Conferences

Comments 0

No comments yet.

Please Login to post a comment