Conference Information

ICAMEM 2026: International Conference on Advanced Materials and Engineering Materials

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Submission Date:
2026-10-16 Closed
Notification Date:
2026-10-23
Conference Date:
2026-12-18
Location:
Singapore
Years:
Organizer:
Viewed: 27685   Tracked: 4   Attend: 8
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ICAMEM
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Conference Partner Index (CP-I)

53.4 / 100
Ranked #1,036 of 5,721 conferences · Top 19%

#5 of 260 in Materials, Mechanical & Manufacturing

Academic recognition (35%) No data - scored at the neutral baseline of 50 —
Submission selectivity (20%) No data - scored at the neutral baseline of 50 —
Editions held (20%)
75
Community attention (10%)
28
Public record completeness (15%)
55

Inputs used: Editions on record: 15 · Researchers following it here: 4 · Researchers who opened this page in the past 24 months: 4

Missing from the public record: Historical acceptance rates (+4.5) · Best-paper records (+2.3)
Organizers can add these from this page after claiming the conference; scores are recomputed nightly. How to raise this score

Confidence 45% - the share of the score backed by observed data rather than the neutral baseline. How this score is calculated · Browse the ranking · Algorithm version 1.2 · Computed 2026-10-18

Call For Papers

ICAMEM 2026 (International Conference on Advanced Materials and Engineering Materials) is an academic conference held in Singapore on 2026-12-18. The paper submission deadline is 2026-10-16 (extended). Acceptance notifications are sent on 2026-10-23.

2026 15th International Conference on Advanced Materials and Engineering Materials (ICAMEM 2026) is the premier forum for the presentation of new advances and research results in the fields of advanced materials and engineering materials. Our wish is to give to all academics, industrials and government agents interested in advanced materials and engineering materials the opportunity to present their work, studies or experiences. Selected papers will be accepted for a 15-minute contributed talk or a poster workshop. One full day of the conference ICAMEM 2026 will be dedicated to this occasion. The conference will bring together leading researchers, engineers and scientists in the domain of interest from around the world. Topics of interest for submission include, but are not limited to: Track 1: Energy, Catalysis & Sustainable Materials and storage, clean fuel production, environmental remediation, and low-carbon technologies. It welcomes research spanning fundamental mechanisms, materials design, device integration, performance evaluation, and scalable pro This track focuses on materials and interfaces that enable efficient energy conversion cesses for batteries, hydrogen technologies, solar and thermal energy systems, catalytic applications, carbon management, and the circular use of resources. Subtopics: T1.1 Batteries, Supercapacitors & Electrochemical Energy Storage T1.2 Hydrogen Production, Electrocatalysis & Fuel Cells T1.3 Solar, Photoelectrochemical & Thermal Energy Conversion T1.4 Environmental Catalysis, Carbon Management & Circular Materials Track 2: Nanomaterials, Electronics, Photonics & Quantum Materials This track covers the design, synthesis, characterization, and integration of materials whose behavior emerges at the nanoscale or through their electronic, optical, magnetic, and quantum properties. Topics range from two-dimensional and heterostructured systems to semiconductors, photonic materials, sensors, and flexible devices, with emphasis on structure–property relationships and next-generation functional technologies. Subtopics: T2.1 Nanomaterials, Two-Dimensional Materials & Heterostructures T2.2 Semiconductors, Dielectrics, Electronics & Memory Materials T2.3 Photonics, Optoelectronics, Magnetic & Quantum Materials T2.4 Sensors, Flexible Electronics & Smart Functional Materials Track 3: Structural, Surface & Composite Materials This track brings together structural materials and surface and interface engineering aimed at improving strength, durability, reliability, and performance under demanding service conditions. It covers metals, alloys, ceramics, composites, and multiphase materials, as well as mechanical behavior, degradation, corrosion, coatings, and tribological performance across aerospace, transportation, energy, marine, construction, nuclear, and other engineering applications. Subtopics: T3.1 Metals, Alloys, Ceramics & Materials for Extreme Environments T3.2 Composites & Multiphase Structural Materials T3.3 Mechanical Behavior, Fatigue, Fracture & Reliability T3.4 Surfaces, Interfaces, Coatings & Corrosion Track 4: Soft, Polymer, Bio & Hybrid Materials This track focuses on soft, polymeric, biological, and hybrid material systems designed for advanced functional and biomedical applications. It welcomes work on molecular and macromolecular design, processing, structure–property relationships, biocompatibility, and biological interactions, including polymers, hydrogels, biomaterials, regenerative scaffolds, drug delivery, bioimaging, biosensing, antimicrobial materials, and sustainable bio-based alternatives. Subtopics: T4.1 Polymers, Soft Matter & Functional Macromolecules T4.2 Biomaterials, Tissue Engineering & Regenerative Materials T4.3 Drug Delivery, Bioimaging, Biosensing & Antimicrobial Materials T4.4 Bio-Based, Biodegradable & Sustainable Hybrid Materials Track 5: Advanced Processing, Characterization & Materials Intelligence This track focuses on methods that accelerate the development, processing, and understanding of advanced materials. It connects advanced manufacturing with characterization, in situ and operando measurements, computational modeling, and data-driven discovery. Contributions may address process control, multiscale simulation, defect and interface analysis, materials informatics, machine learning, digital workflows, and intelligent optimization from laboratory research to industrial implementation. Subtopics: T5.1 Additive Manufacturing, Laser Processing & Joining Technologies T5.2 Advanced Characterization, Defect Engineering & In Situ/Operando Methods T5.3 Computational Materials, Multiscale Modeling & Simulation T5.4 Artificial Intelligence, Materials Informatics & Intelligent Process Design
Last updated by Summer Wang on

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