학회 정보

EuroSimE 2027: International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Microelectronics and Microsystems

학회 웹사이트를 보려면 로그인해 주세요
무료 가입으로 공식 사이트 조회, 마감 추적, 이메일 리마인더를 이용할 수 있습니다.
회원가입 로그인
투고 마감일:
2026-10-26 17일 남음
통보일:
2026-12-17
개최일:
2027-04-11
개최지:
Regensburg, Germany
개최 횟수:
28
캘린더에 추가: Google 캘린더 · Outlook / Apple (.ics)
조회: 8   팔로우: 0   참가: 0
이 페이지에 잘못된 정보가 있나요? 알려 주세요
마감 카운트다운 배지 삽입
EuroSimE
이 데이터를 API로 가져오기
검색과 순위 목록은 자격 증명이 전혀 필요 없습니다. 이 페이지의 상세 데이터에는 무료 API 키가 필요합니다. 자세한 내용은 개발자 안내 페이지를 참고하세요.

논문 모집

EuroSimE 2027 (International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Microelectronics and Microsystems) is an academic conference held in Regensburg, Germany on 2027-04-11. The paper submission deadline is 2026-10-26. Acceptance notifications are sent on 2026-12-17.

Topics Single domain simulation Thermal, mechanical, thermo-mechanical, vibration, shock Chip package board interaction Advanced numerical and analytical simulations methodologies and tools Compact Modelling & Model Order Reduction Digital twins Advanced thermal management concepts Material characterization and validation Material characterization, experiments and modelling Bulk and interface toughness, characterization and modeling Experimental methods for validation of simulation models Failure analysis and failure mode extraction Failure criteria and damage modelling for reliability prediction Application domains Electronic components, packaging and system integration for applications including aerospace, automotive, energy, lighting and medical. MEMS sensors & actuators, piezoelectric, piezoresistive, functional ceramic sensors and components Opto-electronic & opto-mechanical devices Nano-electronic mechanical devices Consumer electronics Multi-physics simulation Multi-physics simulation (MEMS, manufacturing and process models, electronic control unit/system level, fluid structure interactions) Multi-scale modelling and simulation Integrated process modelling Simulation-based optimization, virtual prototyping and prequalification in product and process design Simulations for heterogeneous integration Emerging modeling methods and tools Prognostics and Health Management (PHM) Development and implementation of artificial intelligence and machine learning Use of big data in simulation & reliability applications 3D packaging, TSV technology, heterogenuous integraton, chiplet packaging Additive manufacturing (3D printing) for electronics
최종 수정: Admin Agent ()

관련 학회

CCFICORECP-I약칭정식 명칭투고 마감개최일
AA*95.6SIGIRInternational Conference on Research and Development in Information Retrieval2027-01-142027-07-18
AA*97.8AAAIAAAI Conference on Artificial Intelligence2026-07-212027-02-16
AA*94.5CVPRIEEE Conference on Computer Vision and Pattern Recognition2026-11-102027-06-20
BA*89.7ICRAInternational Conference on Robotics and Automation2026-09-152027-05-24
BA*94.2IJCAIInternational Joint Conference on Artificial Intelligence2026-01-312026-08-15
AA*92.7STOCACM Symposium on Theory of Computing2026-11-022027-06-06
C87.5ICCInternational Conference on Communications2026-10-022027-05-30
CB62.8IJCNNInternational Joint Conference on Neural Networks2027-01-312027-06-14
B91.2ICASSPInternational Conference on Acoustics, Speech and Signal Processing2026-09-162027-05-16
BA*79.7PODSACM SIGMOD Conference on Principles of DB Systems2026-12-032027-06-13

관련 저널

CCF정식 명칭영향력 지수출판사ISSN
AIEEE Transactions on Multimedia9.7IEEE1520-9210
CKnowledge-Based Systems7.2Elsevier0950-7051
BSoftware & Systems Modeling3.2Springer1619-1366
AIEEE Transactions on Computers3.8IEEE0018-9340
CFuture Generation Computer Systems5.9Elsevier0167-739X
CNeurocomputing6.5Elsevier0925-2312
CPattern Recognition Letters3.9Elsevier0167-8655
BPattern Recognition7.6Elsevier0031-3203
IEEE Access3.6IEEE2169-3536
AIEEE Transactions on Dependable and Secure Computing7.5IEEE1545-5971

댓글 0

아직 댓글이 없습니다.

댓글을 작성하려면 로그인해 주세요