Información de la conferencia

EuroSimE 2027: International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Microelectronics and Microsystems

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Día de Entrega:
2026-10-26 Faltan 17 días
Fecha de Notificación:
2026-12-17
Fecha de conferencia:
2027-04-11
Ubicación:
Regensburg, Germany
Ediciones:
28
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EuroSimE 2027 (International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Microelectronics and Microsystems) is an academic conference held in Regensburg, Germany on 2027-04-11. The paper submission deadline is 2026-10-26. Acceptance notifications are sent on 2026-12-17.

Topics Single domain simulation Thermal, mechanical, thermo-mechanical, vibration, shock Chip package board interaction Advanced numerical and analytical simulations methodologies and tools Compact Modelling & Model Order Reduction Digital twins Advanced thermal management concepts Material characterization and validation Material characterization, experiments and modelling Bulk and interface toughness, characterization and modeling Experimental methods for validation of simulation models Failure analysis and failure mode extraction Failure criteria and damage modelling for reliability prediction Application domains Electronic components, packaging and system integration for applications including aerospace, automotive, energy, lighting and medical. MEMS sensors & actuators, piezoelectric, piezoresistive, functional ceramic sensors and components Opto-electronic & opto-mechanical devices Nano-electronic mechanical devices Consumer electronics Multi-physics simulation Multi-physics simulation (MEMS, manufacturing and process models, electronic control unit/system level, fluid structure interactions) Multi-scale modelling and simulation Integrated process modelling Simulation-based optimization, virtual prototyping and prequalification in product and process design Simulations for heterogeneous integration Emerging modeling methods and tools Prognostics and Health Management (PHM) Development and implementation of artificial intelligence and machine learning Use of big data in simulation & reliability applications 3D packaging, TSV technology, heterogenuous integraton, chiplet packaging Additive manufacturing (3D printing) for electronics
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