会议信息

AICsE 2026: International Conference on AI Chips, Integrated Circuits and Electronics

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截稿日期:
2026-07-24 Extended
通知日期:
2026-08-24
会议日期:
2026-09-18
会议地点:
Taiyuan, China
浏览: 921   关注: 0   参加: 0

会伴指数 (CP-I)

43.6 / 100
全站第 3,445 名 / 共 5,684 个会议 · 前 61%

电气与电子工程 第 277 / 510

证据有限：这个会议不在 CCF / ICORE / QUALIS 任何一份榜单里，也没有录用率数据，因此分数的大部分回落到了中性基准。
学术认可 (35%) 无数据 —— 按中性基准 50 分计入 —
投稿选择性 (20%) 无数据 —— 按中性基准 50 分计入 —
会议传承 (20%) 无数据 —— 按中性基准 50 分计入 —
社区关注 (10%)
8
资料公开度 (15%)
35

用到的输入: 过去 24 个月打开过本页的研究者：2 人

公开资料里还缺: 历年录用率 (+4.5) · 历届信息 (+3.0) · 最佳论文记录 (+2.3)
主办方认领本会议后，可直接在这一页补上；分数每晚重算。如何提升这个分数

置信度 25% —— 分数中有多大比例来自实际观测到的数据，而不是中性基准。 这个分数是怎么算出来的 · 查看完整榜单 · 算法版本 1.1 · 算于 2026-09-24

征稿

AICsE 2026 (International Conference on AI Chips, Integrated Circuits and Electronics) is an academic conference held in Taiyuan, China on 2026-09-18. The paper submission deadline is 2026-07-24 (extended). Acceptance notifications are sent on 2026-08-24.

2026 International Conference on AI Chips, Integrated Circuits and Electronics (AICsE 2026) aims to promote the exchange of ideas in Electronics, Chips, Integrated Circuits and it's applications. We warmly welcome submission of original unpublished work in following areas: Track 1 : AI Chips Micro and Nano-electronics Design of Integrated Flexible Electronics Testing and Evaluating of Chips Materials for Chips Edge AI and Embedded AI Chips Memory and Storage Architectures for AI Chips Neural Processing Units (NPUs) and AI Accelerators Advanced Fabrication and Packaging Technologies Security and Trusted AI Computing Design Automation and EDA Tools for AI Chips Photonic AI Accelerators and Co-processors Optoelectronic In-memory Computing for AI Optical Interconnects for Chiplet-based AI Systems Optical Neural Networks and Photonic Tensor Processors Co-packaged Optics (CPO) for AI Clusters Neuromorphic Photonic Computing Chips Track 2 : Integrated Circuits RF/mm-Wave Circuits and Systems Digital Circuits Communication SoCs Nonlinear Signal Processing Circuits Sensor Interface Circuits Wireless Transceivers Sensor Interfaces & MEMS Integration EDA, CAD & Formal Verification EDA Biomedical Circuits Systems, and Applications Bio-inspired Circuits Implantable and/or Wearable Systems Analog Circuits and Techniques Hardware Security & Trust Integrated Silicon Photonic Transceivers High-Performance Optical Sensor Interface Circuits Monolithic and Heterogeneous Optoelectronic Integration (EPIC) Integrated Quantum Photonic Circuits Phase-Locked Loops (PLLs) and Clocking for Optical Transceivers Laser Driver and Modulator Driver ICs Track 3 : Electronics Neuromorphic and Brain-Inspired Electronics Wearable Electronics Signal Processing and Interface Circuits Microsystems and Integration Intelligent Electronics Systems Semiconductor Technologies High-Speed Digital and Mixed-Signal Circuits Flexible and Stretchable Electronics Internet of Things (IoT) Electronics Energy-Efficient Analog and Digital Conversion RF and Wireless Electronics Bio-photonic Wearable Electronics Micro-LED and Nano-LED Display Electronics Photovoltaic Energy Harvesting for IoT Systems FMCW LiDAR System-on-Chip (SoC) Optoelectronic Sensors for Human-Machine Interaction (HMI) Advanced Packaging for Optoelectronic Systems (2.5D/3D)
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