Conference Information

AICsE 2026: International Conference on AI Chips, Integrated Circuits and Electronics

Please Login to view website of conference
Free account: view official websites, track deadlines, and get email reminders.
Register Login
Embed deadline badge
AICsE
Get this via API
Search and ranking lists need no credentials at all; full detail for this page needs a free API key. See the developer guide.
Submission Date:
2026-07-24 Extended
Notification Date:
2026-08-24
Conference Date:
2026-09-18
Location:
Taiyuan, China
Viewed: 922   Tracked: 0   Attend: 0

Conference Partner Index (CP-I)

43.6 / 100
Ranked #3,445 of 5,684 conferences · Top 61%

#277 of 510 in Electrical & Electronic Engineering

Limited evidence: this conference is not listed in CCF / ICORE / QUALIS and has no acceptance-rate data on file, so most of the score falls back to the neutral baseline.
Academic recognition (35%) No data - scored at the neutral baseline of 50 —
Submission selectivity (20%) No data - scored at the neutral baseline of 50 —
Editions held (20%) No data - scored at the neutral baseline of 50 —
Community attention (10%)
8
Public record completeness (15%)
35

Inputs used: Researchers who opened this page in the past 24 months: 2

Missing from the public record: Historical acceptance rates (+4.5) · Past editions (+3.0) · Best-paper records (+2.3)
Organizers can add these from this page after claiming the conference; scores are recomputed nightly. How to raise this score

Confidence 25% - the share of the score backed by observed data rather than the neutral baseline. How this score is calculated · Browse the ranking · Algorithm version 1.1 · Computed 2026-09-24

Call For Papers

AICsE 2026 (International Conference on AI Chips, Integrated Circuits and Electronics) is an academic conference held in Taiyuan, China on 2026-09-18. The paper submission deadline is 2026-07-24 (extended). Acceptance notifications are sent on 2026-08-24.

2026 International Conference on AI Chips, Integrated Circuits and Electronics (AICsE 2026) aims to promote the exchange of ideas in Electronics, Chips, Integrated Circuits and it's applications. We warmly welcome submission of original unpublished work in following areas: Track 1 : AI Chips Micro and Nano-electronics Design of Integrated Flexible Electronics Testing and Evaluating of Chips Materials for Chips Edge AI and Embedded AI Chips Memory and Storage Architectures for AI Chips Neural Processing Units (NPUs) and AI Accelerators Advanced Fabrication and Packaging Technologies Security and Trusted AI Computing Design Automation and EDA Tools for AI Chips Photonic AI Accelerators and Co-processors Optoelectronic In-memory Computing for AI Optical Interconnects for Chiplet-based AI Systems Optical Neural Networks and Photonic Tensor Processors Co-packaged Optics (CPO) for AI Clusters Neuromorphic Photonic Computing Chips Track 2 : Integrated Circuits RF/mm-Wave Circuits and Systems Digital Circuits Communication SoCs Nonlinear Signal Processing Circuits Sensor Interface Circuits Wireless Transceivers Sensor Interfaces & MEMS Integration EDA, CAD & Formal Verification EDA Biomedical Circuits Systems, and Applications Bio-inspired Circuits Implantable and/or Wearable Systems Analog Circuits and Techniques Hardware Security & Trust Integrated Silicon Photonic Transceivers High-Performance Optical Sensor Interface Circuits Monolithic and Heterogeneous Optoelectronic Integration (EPIC) Integrated Quantum Photonic Circuits Phase-Locked Loops (PLLs) and Clocking for Optical Transceivers Laser Driver and Modulator Driver ICs Track 3 : Electronics Neuromorphic and Brain-Inspired Electronics Wearable Electronics Signal Processing and Interface Circuits Microsystems and Integration Intelligent Electronics Systems Semiconductor Technologies High-Speed Digital and Mixed-Signal Circuits Flexible and Stretchable Electronics Internet of Things (IoT) Electronics Energy-Efficient Analog and Digital Conversion RF and Wireless Electronics Bio-photonic Wearable Electronics Micro-LED and Nano-LED Display Electronics Photovoltaic Energy Harvesting for IoT Systems FMCW LiDAR System-on-Chip (SoC) Optoelectronic Sensors for Human-Machine Interaction (HMI) Advanced Packaging for Optoelectronic Systems (2.5D/3D)
Last updated by Admin Agent on

Related Conferences

Related Journals

CCFFull NameImpact FactorPublisherISSN
Analog Integrated Circuits and Signal Processing1.4Springer0925-1030
AArtificial Intelligence4.6Elsevier0004-3702
Robotics and Computer-Integrated Manufacturing11.4Elsevier0736-5845
AIEEE Transactions on Multimedia9.7IEEE1520-9210
CKnowledge-Based Systems7.2Elsevier0950-7051
BSoftware & Systems Modeling3.2Springer1619-1366
AIEEE Transactions on Computers3.8IEEE0018-9340
CFuture Generation Computer Systems5.9Elsevier0167-739X
CNeurocomputing6.5Elsevier0925-2312
CPattern Recognition Letters3.9Elsevier0167-8655

Comments 0

No comments yet.

Please Login to post a comment