Conference Information

EIECT 2026: International Conference on Electronic Information Engineering and Computer Technology

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Submission Date:
2026-08-01 Due in 50 days
Notification Date:
Conference Date:
2026-09-04
Location:
Beijing, China
Years:
6
Viewed: 11864   Tracked: 1   Attend: 2

Call For Papers

EIECT 2026 (International Conference on Electronic Information Engineering and Computer Technology) is an academic conference held in Beijing, China on 2026-09-04. The paper submission deadline is 2026-08-01.

With the rapid development of science and technology, the innovation of computer technology is changing with each passing day, and its intelligence and networking make people's life more convenient. Electronic information engineering relies on computer technology to convert logical numbers such as data into interpretable information, infiltrating all aspects of society, making electronic and information products continue to innovate, and making electronic information engineering have broader prospects. The combination of the two must also be will become the main direction of future development. Focusing on the latest research in "Electronic Information Engineering and Computer Technology", 2026 6th International Conference on Electronic Information Engineering and Computer Technology will be held in Beijing, China during September 4-6, 2026. Continuing the spirit of "Sharing · Exchange" of EIECT, we welcome experts and scholars in related fields to submit their new research or technical contributions to EIECT 2026, and share valuable experiences with scientists and scholars from all over the world! The topics of interest for submission include, but are not limited to: Track 1: Electronic Information Engineering ◕ Communication and Wireless Technologies 6G Frontier Communications Future Cellular Networks Terahertz Communications Satellite-Integrated Communications Internet of Vehicles (IoV) Communications Space-Air-Ground Integrated Networks Intelligent Reflecting Surfaces (IRS) Massive MIMO Ultra-Reliable and Low-Latency Communications (URLLC) Mobile Edge Collaboration Cognitive Radio Networks Intelligent Spectrum Management Communication Resource Optimization Quantum-Safe Communications Green and Low-Carbon Communications ◕ Network Architectures and Protocol Technologies Next-Generation Internet Software-Defined Networking (SDN) Network Function Virtualization (NFV) Data Center Networks Cloud-Edge-End Collaboration Industrial Internet of Things (IIoT) Networks Smart City Networks Blockchain Networks Network Slicing Technology Network Security Protection Self-Controlled and Controllable Protocols High-Speed Optical Fiber Networks Edge Intelligence Networks Time-Sensitive Networking (TSN) Architecture Network Measurement and Analysis ◕ Signal Processing and Intelligent Sensing Intelligent Signal Processing Multi-Modal Fusion Sensing Radar Signal Recognition Communication Signal Detection Intelligent Image Coding Speech Enhancement and Recognition Target Tracking and Localization Deep Learning for Signals Time-Frequency Analysis Methods Sensor Data Fusion Biometric Recognition Intelligent Edge Sensing Noise-Robust Processing Compressed Sensing Technology Intelligent Monitoring Systems Track 2: Computer Technology ◕ Artificial Intelligence and Large Models Artificial Intelligence for Communications (AI4Comm) AI Theory Reinforcement Learning Federated Learning Trustworthy and Secure AI Multi-Modal Large Models Generative Artificial Intelligence Model Compression and Acceleration ◕ Computer Technologies Intelligent Computing Architecture High-Performance Computing (HPC) Heterogeneous Computing Architecture Distributed Systems Cloud-Native Technology Edge Computing Systems Network Collaborative Computing Distributed Intelligent Agents Computing-Driven Communications ◕ Data Intelligence and Application Systems Data Mining Knowledge Graph Intelligent Recommendation Systems Privacy-Preserving Computation Intelligent Internet of Things (IIoT) Intelligent Transportation Systems Smart Healthcare Networks Communications for Smart Manufacturing Networked Robotics Educational and Learning Networks Track 3: Electronics and Integrated Circuits ◕ Integrated Circuit Design and Manufacturing Integrated Circuit Design Low-Power IC Advanced Process Technology System-on-Chip (SoC) 3D Packaging Technology ◕ Semiconductor Devices and Materials Semiconductor Materials Power Electronic Devices Optoelectronics and Integrated Photonics Nanoelectronic Devices Quantum Devices ◕ Embedded and Electronic Systems Reconfigurable Computing Embedded Systems Sensors Intelligent Hardware Systems Electronic Testing and Measurement
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