Conference Information
FLEPS 2021: IEEE International Conference on Flexible, Printable Sensors and Systems
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Call For Papers
IEEE FLEPS 2021 is intended to provide a forum for research scientists, engineers, and practitioners throughout the world to present their latest research findings, ideas, and applications in the area of Flexible and Printable Sensors and Systems

Topics of Interest

    Organic/Inorganic Electronic Sensors
    Emerging Materials for Flexible and Printable Systems
    Manufacturing Techniques
    High-throughput Printable Electronics
    Hybrid Flexible Sensors and Electronics
    Stretchable/Shrinkable Sensors and Electronics
    Soft/Smart Wearable and Implantable Sensing Systems
    Disposable/Reusable Sensors and Electronics
    Printed Large-Area Sensors and Systems
    Flexible or Printed Active and Passive Components (e.g.
    actuators, printed energy devices, smart labels, RFID etc.)
    Emerging applications of Flexible Electronics inc. IoT, smart cities etc.
    Simulation and Modelling
    Flexible/Printable Electronics in context with Circular Economy and green electronics

Publication of Papers

Presented papers will be included in the Proceedings of IEEE FLEPS 2021 and in IEEE Xplore pending author requirements being met. Authors may submit an extended IEEE FLEPS 2021 papers to the Special Journal Issue in the IEEE Sensors Journal.

Exhibition & Patron Opportunities

The Conference exhibit area will provide your company or organization with the opportunity to inform and display your latest products, services, equipment, books, journals, and publications to attendees from around the world.

For further information, contact Coral Miller at Conference Catalysts, LLC.
Last updated by Dou Sun in 2021-03-14
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