会议信息

FLEPS 2021: IEEE International Conference on Flexible, Printable Sensors and Systems

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截稿日期:
2021-03-15
通知日期:
2021-05-10
会议日期:
2021-06-20
会议地点:
Online
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征稿

FLEPS 2021 (IEEE International Conference on Flexible, Printable Sensors and Systems) is an academic conference held in Online on 2021-06-20. The paper submission deadline is 2021-03-15. Acceptance notifications are sent on 2021-05-10.

IEEE FLEPS 2021 is intended to provide a forum for research scientists, engineers, and practitioners throughout the world to present their latest research findings, ideas, and applications in the area of Flexible and Printable Sensors and Systems Topics of Interest Organic/Inorganic Electronic Sensors Emerging Materials for Flexible and Printable Systems Manufacturing Techniques High-throughput Printable Electronics Hybrid Flexible Sensors and Electronics Stretchable/Shrinkable Sensors and Electronics Soft/Smart Wearable and Implantable Sensing Systems Disposable/Reusable Sensors and Electronics Printed Large-Area Sensors and Systems Flexible or Printed Active and Passive Components (e.g. actuators, printed energy devices, smart labels, RFID etc.) Emerging applications of Flexible Electronics inc. IoT, smart cities etc. Simulation and Modelling Flexible/Printable Electronics in context with Circular Economy and green electronics Publication of Papers Presented papers will be included in the Proceedings of IEEE FLEPS 2021 and in IEEE Xplore pending author requirements being met. Authors may submit an extended IEEE FLEPS 2021 papers to the Special Journal Issue in the IEEE Sensors Journal. Exhibition & Patron Opportunities The Conference exhibit area will provide your company or organization with the opportunity to inform and display your latest products, services, equipment, books, journals, and publications to attendees from around the world. For further information, contact Coral Miller at Conference Catalysts, LLC.
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