会议信息

ICICM' 2026: International Conference on Integrated Circuits and Microsystems

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截稿日期:
2026-09-15 已截稿
通知日期:
2026-09-30
会议日期:
2026-10-16
会议地点:
Xi an, China
届数:
11
主办方:
浏览: 31479   关注: 3   参加: 2
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会伴指数 (CP-I)

49.4 / 100
全站第 1,837 名 / 共 5,764 个会议 · 前 32%

电气与电子工程 第 119 / 520

学术认可 (35%) 无数据 —— 按中性基准 50 分计入 —
投稿选择性 (20%) 无数据 —— 按中性基准 50 分计入 —
会议传承 (20%)
67
社区关注 (10%)
33
资料公开度 (15%)
35

用到的输入: 有据可查的届次：11 · 在会伴关注它的研究者：3 人 · 过去 24 个月打开过本页的研究者：12 人

公开资料里还缺: 历年录用率 (+4.5) · 历届信息 (+3.0) · 最佳论文记录 (+2.3)
主办方认领本会议后，可直接在这一页补上；分数每晚重算。如何提升这个分数

置信度 45% —— 分数中有多大比例来自实际观测到的数据，而不是中性基准。 这个分数是怎么算出来的 · 查看完整榜单 · 算法版本 1.2 · 算于 2026-11-01

征稿

ICICM' 2026 (International Conference on Integrated Circuits and Microsystems) is an academic conference held in Xi an, China on 2026-10-16. The paper submission deadline is 2026-09-15 (extended). Acceptance notifications are sent on 2026-09-30.

Topics (related to the below topics, but not only limited) Track 1: Electronic Design Automation (EDA) Progress of EDA algorithms EDA for emerging technologies Hardware-software co-design with EDA EDA in High Performance Computing (HPC) EDA in analog and mixed-signal design Security and reliability in EDA Open Source EDA Initiative EDA and Internet of Things (IoT) EDA for FPGA and ASIC design EDA in the automotive industry Track 2: Integrated Circuit and System Design Digital, analog, mixed-signal IC and SOC design technology IC computer-aided design technology, DFM Modeling and simulation Track 3: Semiconductor Devices and Circuits Components and circuits for wireless systems Low power, RF devices and circuits Silicon/Germanium Devices and Device Physics Compound semiconductor devices and circuits Non-traditional and nanoelectronics Organic semiconductor devices and technologies Photonics and optoelectronics Track 4: Process Technology and Manufacturing Silicon integrated circuits and manufacturing Interconnect, low-K, high-K and other process technologies Packaging and testing technology, equipment technology 3D integration and advanced packaging Chiplet technology Track 5: Microelectromechanical systems (MEMS) and sensors THz and microwave microsystems Displays, sensors and MEMS Energy harvesting and wireless sensors BioMEMS and biomedical sensors Track 6: Intelligent System Design Software and hardware co-design AI digital and analog software and hardware optimization System-on-chip multi-objective optimization GPU, TPU, DPU and dedicated AI accelerator space design optimization Track 7: Energy sources and storage Solar cells and other new energy equipment Advanced storage technologies (Flash, FeRAM, PCM, ReRAM, MRAM, etc.) Batteries and energy storage systems Track 8: Applications and other topics Communications ASICs and systems Artificial Intelligence and Machine Learning in IC and System Design Quantum computing and quantum electronics Track 9: IC for Security and Security for IC Hardware-intrinsic security primitives (e.g., PUF, TRNG, PQC/FHE/NTT) Architectural and microarchitectural attacks and defenses Secure system-on-chip (SoC) architecture Trusted platform modules and hardware virtualization Side-channel attacks and countermeasures Hardware IP core protection and trust for consumer electronics systems and IoT Security and trust of AI/ML, and AI/ML for hardware security Hardware-assisted cross-layer security Emerging nanoscale technologies in hardware security applications
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