Conference Information

ICICM' 2026: International Conference on Integrated Circuits and Microsystems

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Submission Date:
2026-09-15 Closed
Notification Date:
2026-09-30
Conference Date:
2026-10-16
Location:
Xi an, China
Years:
11
Organizer:
Viewed: 31480   Tracked: 3   Attend: 2
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ICICM'
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Conference Partner Index (CP-I)

49.4 / 100
Ranked #1,837 of 5,764 conferences · Top 32%

#119 of 520 in Electrical & Electronic Engineering

Academic recognition (35%) No data - scored at the neutral baseline of 50 —
Submission selectivity (20%) No data - scored at the neutral baseline of 50 —
Editions held (20%)
67
Community attention (10%)
33
Public record completeness (15%)
35

Inputs used: Editions on record: 11 · Researchers following it here: 3 · Researchers who opened this page in the past 24 months: 12

Missing from the public record: Historical acceptance rates (+4.5) · Past editions (+3.0) · Best-paper records (+2.3)
Organizers can add these from this page after claiming the conference; scores are recomputed nightly. How to raise this score

Confidence 45% - the share of the score backed by observed data rather than the neutral baseline. How this score is calculated · Browse the ranking · Algorithm version 1.2 · Computed 2026-11-01

Call For Papers

ICICM' 2026 (International Conference on Integrated Circuits and Microsystems) is an academic conference held in Xi an, China on 2026-10-16. The paper submission deadline is 2026-09-15 (extended). Acceptance notifications are sent on 2026-09-30.

Topics (related to the below topics, but not only limited) Track 1: Electronic Design Automation (EDA) Progress of EDA algorithms EDA for emerging technologies Hardware-software co-design with EDA EDA in High Performance Computing (HPC) EDA in analog and mixed-signal design Security and reliability in EDA Open Source EDA Initiative EDA and Internet of Things (IoT) EDA for FPGA and ASIC design EDA in the automotive industry Track 2: Integrated Circuit and System Design Digital, analog, mixed-signal IC and SOC design technology IC computer-aided design technology, DFM Modeling and simulation Track 3: Semiconductor Devices and Circuits Components and circuits for wireless systems Low power, RF devices and circuits Silicon/Germanium Devices and Device Physics Compound semiconductor devices and circuits Non-traditional and nanoelectronics Organic semiconductor devices and technologies Photonics and optoelectronics Track 4: Process Technology and Manufacturing Silicon integrated circuits and manufacturing Interconnect, low-K, high-K and other process technologies Packaging and testing technology, equipment technology 3D integration and advanced packaging Chiplet technology Track 5: Microelectromechanical systems (MEMS) and sensors THz and microwave microsystems Displays, sensors and MEMS Energy harvesting and wireless sensors BioMEMS and biomedical sensors Track 6: Intelligent System Design Software and hardware co-design AI digital and analog software and hardware optimization System-on-chip multi-objective optimization GPU, TPU, DPU and dedicated AI accelerator space design optimization Track 7: Energy sources and storage Solar cells and other new energy equipment Advanced storage technologies (Flash, FeRAM, PCM, ReRAM, MRAM, etc.) Batteries and energy storage systems Track 8: Applications and other topics Communications ASICs and systems Artificial Intelligence and Machine Learning in IC and System Design Quantum computing and quantum electronics Track 9: IC for Security and Security for IC Hardware-intrinsic security primitives (e.g., PUF, TRNG, PQC/FHE/NTT) Architectural and microarchitectural attacks and defenses Secure system-on-chip (SoC) architecture Trusted platform modules and hardware virtualization Side-channel attacks and countermeasures Hardware IP core protection and trust for consumer electronics systems and IoT Security and trust of AI/ML, and AI/ML for hardware security Hardware-assisted cross-layer security Emerging nanoscale technologies in hardware security applications
Last updated by Dunn Carl on

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