Conference Information
ICICM' 2023: International Conference on Integrated Circuits and Microsystems
Submission Date:
2023-09-10 Extended
Notification Date:
Conference Date:
Nanjing, China
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Call For Papers
(related to the below topics, but not only limited)

    Track 1: Integrated Circuits and Systems Design
    • Digital, Analog, Mixed Signal IC and SOC design technology
    • IC Computer-Aided –Design technology, DFM
    • Modeling and simulation

    Track 2: Semiconductor Devices and Circuits
    • Devices and Circuits for Wireless Systems
    • Low-power, RF devices & circuits
    • Silicon/germanium devices and device physics
    • Compound semiconductor devices and circuits
    • Unconventional and nano-electronics
    • Organic semiconductor devices and technologies
    • Photonics and optoelectronics

    Track 3: Process Technologies and Manufacturing
    • Silicon integrated circuits and manufacturing
    • Interconnect, Low K, High K and other process technologies
    • Equipment technology
    • 3D integration and advanced packaging

Track 4: MEMS and Sensors
• Thz and Microwave MicroSystem
• Displays, sensors, and MEMS
• Energy harvesting and wireless sensors
• BioMEMS and biomedical sensors

Track 5: Energy Sources and Storage
• Solar cell & other devices for new energy sources
• Advance memories technology (Flash, FeRAM, PCM, ReRAM, MRAM, etc.)
• Batteries and energy storage systems

Track 6: Applications and Other Topics
• Application Specific Circuits and Systems for Communication
• Packaging and testing technology
• Reliability
• AI and machine learning in IC and system design
• Quantum computing and quantum electronics
Last updated by Dunn Carl in 2023-08-21
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