Journal Information
Journal of Manufacturing Processes
Impact Factor:
Call For Papers
Manufacturing is undergoing major transformation due to the unforeseen challenges arising from the current trend of miniaturization, the emergence of new materials and the growing interaction between biologists and engineers to learn more from nature and living objects.

Traditionally, a "top-down" approach has been used in manufacturing. Recently, engineers and scientists have begun exploring "bottom-up" approaches for manufacturing today's highly complex products. Further, these emerging processes are aimed to improve process efficiency and product quality.

The aim of the Journal of Manufacturing Processes (JMP) is to exchange current and future directions of manufacturing processes research, development and implementation, and to publish archival scholarly literature with a view to advancing state-of-the-art manufacturing processes and encouraging innovation for developing new and efficient processes. The journal will also publish from other research communities for rapid communication of innovative new concepts. Special-topic issues on emerging technologies and invited papers will also be published.

Papers relevant to the scope of JMP include, but are not limited to, the following areas:
• Meso/micro/nano fabrication, including imprint lithography.
• Advanced manufacturing processes, including mechanical, chemical and thermal processes.
• Welding, joining and assembly at micro and macro scales.
• Rapid prototyping, rapid manufacturing and repair, stereolithography and other 3-D fabrication techniques that can use optical projection.
• Advanced embossing, casting, forming and molding processes at all scales.
• Mono/multilayer functional coating processes.
• Continuum and subcontinuum process modeling and simulation.
• Manufacturing process monitoring, control and automation.
• Tribology and wear issues relevant to manufacturing processes.
Last updated by Dou Sun in 2022-01-29
Special Issues
Special Issue on Innovative Process, Monitoring and Control in The Wire Arc Additive Manufacturing
Submission Date: 2024-04-30

The Wire-arc based direct energy deposition (DED), also widely known as Wire Arc Additive Manufacturing (WAAM), is a fast-growing AM technology that is suitable for fabricating median to large sized metal components due to its lower equipment and consumable cost and higher deposition rate compared to other AM alternatives. In the past decade, it has quickly evolved from laboratory feasibility study to practical industrial applications. However, most of the existing Wire-arc DED adopts existing robotic welding equipment that are designed for welding and does not align with the demanding requirements from AM. More revolutionary innovations are yet to be made to resolve challenging problems such as poor geometrical accuracy and surface finish, large distortion and residual stress caused by large heat input, lack of close loop monitoring and control. In response to such rapid progresses and challenges, this special issue wishes to publish a collection of the state-of-the-art developments of innovative processes, monitoring and control in Wire-arc based direct energy deposition. The special issue is also open to review papers that provide critical analysis of such state-of-the-art innovative applications. We plan for the special issue to publish ten to twenty research papers (approximately 10 pages each), three to five review papers (approximately 20 pages each) and two overview paper for the analysis of the state-of-the-art and future directions contributed by the guest editors. All papers that related to innovative process development, process monitoring and control technologies for improving wire-arc direct energy deposition process are encouraged. Authors, especially those who are interested in contributing a review article/paper, are encouraged to send abstracts to one of the Guest Editors for an optional evaluation of suitability. Guest editors: Zengxi PanUniversity of Wollongong, Wollongong, Australia( Wei ZhouNanyang Technological University, Singapore, Singapore( Craig BriceColorado School of Mines, Golden, Colorado, United States of America( Zhifen ZhangXi'an Jiaotong University, Xi'an, China( Manuscript submission information: Manuscript submission deadline: 30 April 2024
Last updated by Dou Sun in 2024-02-01
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