Conference Information

DAIS 2026: International Conference on Distributed Applications and Interoperable Systems

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Submission Date:
Notification Date:
Conference Date:
2026-06-08
Location:
Urbino, Italy
Years:
26
QUALIS: B2   Viewed: 31711   Tracked: 4   Attend: 0

Call For Papers

DAIS 2026 (International Conference on Distributed Applications and Interoperable Systems) is a QUALIS B2 conference held in Urbino, Italy on 2026-06-08.

Scope The DAIS conference series addresses all practical and conceptual aspects of distributed applications, including their design, modeling, implementation and operation, the supporting middleware, appropriate software engineering methodologies and tools, as well as experimental studies and applications. Submissions will be judged on their originality, significance, clarity, relevance, and technical correctness. The topics of interest to the conference include, but are not limited to: Novel and innovative distributed applications and systems, particularly in the areas of middleware, cloud, edge and fog computing, big data processing, distributed embedded machine learning (TinyML), decentralised/distributed AI/ML, streaming and complex event processing, distributed social networking, IoT and cyber-physical systems, mobile computing, advanced networking (SDN/NFV), micro-services and service-oriented computing, peer-to-peer systems, and data center and internet-scale systems. Novel architectures and mechanisms, particularly in the areas of publish/subscribe systems, epidemic protocols, language-based approaches, virtualization and resource allocation, distributed storage, large-scale data management, trusted execution environments, blockchains, cryptocurrencies and smart contracts, and distributed consensus mechanisms. System issues and design goals, including interoperability and adaptation, self-* properties (e.g., self-organization, self-management,…), security and practical applications of cryptography, trust and privacy, cooperation incentives and fairness, fault-tolerance and dependability, scalability and elasticity, and tail-performance and energy-efficiency.
Last updated by Dou Sun on

Acceptance Ratio

Average acceptance rate: 39.7% over 10 years (1997–2010).

YearSubmittedAcceptedAccepted(%)
2010531732.1%
2009331236.4%
2008662436.4%
2007742432.4%
2006782633.3%
2005442250%
2003882629.5%
2001652640%
1999883236.4%
1997312271%

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