会議情報
TEI 2026: International Conference on Tangible, Embedded and Embodied Interaction
https://tei.acm.org/2026/提出日: |
2025-07-31 |
通知日: |
2025-10-15 |
会議日: |
2026-03-08 |
場所: |
Chicago, Illinois, USA |
年: |
20 |
CORE: a QUALIS: b1 閲覧: 19737 追跡: 4 出席: 0
論文募集
We invite paper submissions from a wide range of perspectives: technical, applied, empirical, theoretical, philosophical, conceptual, and artistic. We welcome contributions from fields including but not limited to: tangible interaction design, embodied interaction design, embedded computing, digital fabrication, hybrid craft, e-textiles, wearables, haptics, robotics, smart cities, smart materials, and sustainability. As this year's theme is 'Tide + Tied', we invite submissions that explore interdisciplinary knowledge, bridging the physical and digital, technology and humanity, resurgence and convergence, and beyond. We expect submissions to be clearly framed within the rapidly developing tangible, embedded, and embodied interaction field. Works framed as research through design and more technical contributions are particularly welcome. Authors are encouraged to submit a paper with a length proportional to its contribution. While there is no maximum or minimum length for papers, the length of typical submissions is expected to be approximately 7,000–8,000 words excluding references, figure/table captions, and appendices. Reviewers will be instructed to weigh the contribution of a submission relative to its method and length. Papers should be succinct but thorough in presenting the work. Shorter, more focused papers are encouraged and will be reviewed like any other paper. Papers whose lengths are incommensurate with their contributions will be rejected. General Information TEI 2026 is the 20th annual conference dedicated to tangible, embedded, and embodied interaction. The ACM TEI conference brings together researchers, practitioners, artists, designers and students from a variety of disciplines, including interaction design, computer science, engineering, product design, media studies and the arts. The intimate size of this single-track conference provides a unique forum for exchanging ideas and presenting innovative work through talks, demonstrations, posters, art installations, performances, hands-on studios, and scholarly workshops. We invite paper submissions from a wide range of perspectives: technical, applied, empirical, theoretical, philosophical, conceptual, and artistic. We welcome contributions from fields including but not limited to: tangible interaction design, embodied interaction design, embedded computing, digital fabrication, hybrid craft, e-textiles, wearables, haptics, robotics, smart cities, smart materials, and sustainability. As this year's theme is 'Tide + Tied', we invite submissions that explore interdisciplinary knowledge, bridging the physical and digital, technology and humanity, resurgence and convergence, and beyond. We expect submissions to be clearly framed within the rapidly developing tangible, embedded, and embodied interaction field. Works framed as research through design and more technical contributions are particularly welcome.
最終更新 Dou Sun 2025-10-28
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関連会議
| 省略名 | 完全な名前 | 会議日 |
|---|---|---|
| RTCSA | International Conference on Embedded and Real-Time Computing Systems and Applications | 2025-08-20 |
| CC | International Conference on Compiler Construction | 2026-01-31 |
| ICESS | International Conference on Embedded Software and Systems | 2025-08-13 |
| INTERACT | International Conference on Human-Computer Interaction | 2025-09-08 |
| HCII | International Conference on Human-Computer Interaction | 2016-07-17 |
| RTAS | IEEE Real-Time and Embedded Technology and Applications Symposium | 2026-05-12 |
| ACHI | International Conference on Advances in Computer-Human Interactions | 2023-04-24 |
| HRI | International Conference on Human-Robot Interaction | 2025-03-04 |
| ICMI | International Conference on Multimodal Interaction | 2025-10-13 |
| TEI | International Conference on Tangible, Embedded and Embodied Interaction | 2026-03-08 |
関連仕訳帳
| CCF | 完全な名前 | インパクト ・ ファクター | 出版社 | ISSN |
|---|---|---|---|---|
| ACM Transactions on Human-Robot Interaction | 4.200 | ACM | 2573-9522 | |
| Advances in Human-Computer Interaction | 2.300 | Hindawi | 1687-5893 | |
| International Journal of Embedded Systems and Applications | AIRCC | 1839-5171 | ||
| b | User Modeling and User-Adapted Interaction | 3.000 | Springer | 0924-1868 |
| International Journal of Child-Computer Interaction | Elsevier | 2212-8689 | ||
| b | International Journal of Human-Computer Interaction | 3.400 | Taylor & Francis | 1044-7318 |
| b | Human–Computer Interaction | Taylor & Francis | 0737-0024 | |
| c | Higher-Order and Symbolic Computation | Springer | 1388-3690 | |
| International Journal of Telemedicine and Applications | 3.100 | Hindawi | 1687-6415 | |
| Journal of Computer and Systems Sciences International | 0.500 | Springer | 1064-2307 |
| 完全な名前 | インパクト ・ ファクター | 出版社 |
|---|---|---|
| ACM Transactions on Human-Robot Interaction | 4.200 | ACM |
| Advances in Human-Computer Interaction | 2.300 | Hindawi |
| International Journal of Embedded Systems and Applications | AIRCC | |
| User Modeling and User-Adapted Interaction | 3.000 | Springer |
| International Journal of Child-Computer Interaction | Elsevier | |
| International Journal of Human-Computer Interaction | 3.400 | Taylor & Francis |
| Human–Computer Interaction | Taylor & Francis | |
| Higher-Order and Symbolic Computation | Springer | |
| International Journal of Telemedicine and Applications | 3.100 | Hindawi |
| Journal of Computer and Systems Sciences International | 0.500 | Springer |