Microelectronic Engineering is an academic journal published by Elsevier. (ISSN 0167-9317, impact factor 3.1).
Nanotechnology and Processing — Electronics, photonics, MEMS and Life Sciences
Affiliated with iMNEs
Microelectronic Engineering is the premier journal focused on the fabrication and characterization of micro/nano-electronic materials, devices and circuits (including novel electronic nanomaterials), as well as the understanding of their working mechanisms, performance, yield, variability, stability, and reliability. The journal also focuses on the techniques that make possible the fabrication and characterization of such devices and circuits, and on the materials involved in them. Occasionally, outstanding papers on simulation of materials properties, device figures-of-merit or compact modeling of circuits and systems may be accepted. The following topics are of special interest:
Devices
Photonic and optoelectronic devices (including, sensors, actuators, phototransistors)
Transistors (including ultra-scaled, thin film, organic, ferroelectric)
Resistive switching devices (memristors, RRAM, PCRAM, FeRAM, MRAM)
Magnetic and spintronic devices
MEMS and NEMS (including power, RF, magnetic, organic)
Flexible electronic devices (including wearable, printed, paper)
Devices for energy harvesting (piezoelectric, flexoelectric, photovoltaic, solar cells)
Bioelectronic devices (molecular detection, biomimetic, diagnosis)
Device-level simulations (including variability and reliability)
Materials
Wide bandgap semiconductors
Dielectrics (low K and high K)
Two-dimensional (2D) Materials and related transferring techniques
Nanotubes, nanowires, and other nanomaterials and nanostrctures for device fabrication
Interconnects, metallization and barrier materials
New Resist Materials
Silicon on insulators
Polymers and flexible substrates, including biocompatible materials
Atomistic simulations of materials properties
Fabrication and characterization processes
Thin films deposition techniques (CVD, ALD, evaporation, sputtering, MBE, plasma)
Lithography (including optical, EUV, electron beam, nanoimpring, particle-assisted, mask less, X-ray optical methods, emerging methods and limits, as well as resists)
Pattern transfer (including ion, plasma and wet transfer, as well as transfer of 2D materials)
Integration processes (including inkjet printing, 3D printing, 3D integration)
Top-down and bottom-up self-assembly processes
Annealing and its effect in the materials (including crystallization, wrinkling, de-wetting)
Nanometrology (TEM, SEM, EDX, EELS, STM, AFM and related setups)
Circuits and applications
Sensing and actuation, including bio-compatible applications
Signal souring and transfer
Logic operations and data processing
Electronic memories and information storage
Artificial neural networks and neuromorphic computing
Compact modeling of electronic circuits
Quantum computing
Five different types of articles are considered:
Research articles that report regular original research that produces significant advancement.
Accelerated Publications (Letters) that feature exciting research breakthroughs.
Review Articles that inform readers of the latest research and advances in a topic within the broad field of microelectronic engineering. This includes roadmaps and guides proposing the recommended methods in a specific field.
Short / Technical notes intended for original limited investigations or short description of original industrial or industrially-related research and development work
News and Opinions that comment on topical issues or express views on the developments in related fields, or comment on previously published work
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