MicDAT 2020 (International Conference on Microelectronic Devices and Technologies) is an academic conference held in Tenerife, Spain on 2020-06-17. The paper submission deadline is 2020-03-15. Acceptance notifications are sent on 2020-04-15.
The conference is the third of a series of annual International Conferences on Microelectronic Devices and Technologies (MicDAT) held in Barcelona (Spain), 2018 and in Amsterdam (The Netherlands), 2019 organized by IFSA. The MicDAT' 2020 conference is intended to create awareness of the huge potential of modern microelectronic technologies and to improve understanding on the recent challenges in a wide range of applications. The many different technological bases for the fabrication of microelectronic devices, SoC, SiP, MEMS and NEMS will be outlined in this 3-day conference.
A number of recognized experts from both: academy and industry in the field of microelectronic design will be invited to give their view in selected application areas. Featuring strong participation of industry and academia, the MicDAT' 2020 conference will provide an excellent opportunity to exchange ideas and present latest advancements in these areas.
The aim of MicDAT series of conference is to provide an annual world forum for the presentation and discussion of recent advances in microelectronics, and bring together leading international researchers, engineers and practitioners interested on any of the microelectronics related technologies. The conference will offer plenary and invited talks, contributed oral and poster presentations, special sessions, tutorials, and exhibitions of commercial products. Social and cultural events will also take place to foster networking among the participants in a friendly manner. The conference is coordinated with the IFSA series of conferences, which deal with physics and engineering.
We trust that you will find MicDAT' 2020 conference professionally rewarding and stimulating as well as enjoyable.
The topics of interest include (but not limited):
Analog, digital, mixed, and RF circuits and related design methodologies
Analog-to-Digital Converters (ADC)
Voltage-to-Frequency Converts (VFC)
Frequency-to-Digital Converters (FDC)
Time-to-Digital Converters (TDC)
Semiconductor Devices: physics and technology
Logic, architectural, and system level synthesis
Nonlinear circuits
Microprocessors, microcontrollers and DSPs
Testing, design for testability, built-in self-test
Area, power, and thermal analysis and design
Mixed-domain simulation and design
Embedded systems, low-power designs
VLSI systems circuit and design
Non-von Neumann computing and related technologies and circuits
Design and test of high complexity systems integration
SoC, MPSoC, NoC, SIP, and NIP design and test
Process technologies, CMOS, BJT, BiCMOS, GaAs
3-D integration design and analysis
Emerging device technologies and circuits, such as FinFETs, SETs, spintronics, SFQ, MTJ, etc.
Design for Manufacturability/Technology Optimization/Yield & Quality
Microelectronics processing and materials
Semiconductor processing
Modern electronics materials
Solid-state electronics
Quantum electronics
Thin solid films
Nanoprocessing, nanotechnology and nanofabrication
Flexible and stretchable electronics
MEMS and NEMS
CAD tools for microelectronics
Hardware/software co-design
Algorithms, methods and tools for modeling, simulation, synthesis and verification of ICs
Electronic materials science and technology
Organic electronic materials and devices
Microelectronics reliability and qualification
Assembly and Packaging
Contribution Types:
Keynote presentations and invited talks
Industrial presentations
Special Sessions presentations
Regular papers
Posters
Exhibition
Special Sessions:
Authors are welcome to organize and manage special sessions during the conference. Each session will contain 4-6 papers in a related field as specified above.
Session organizers will get:
Certificate of appreciation
Free registration for the event
Special publishing theme within conference proceedings
Free article and book chapter post conference publications in appropriate open access journals and ‘Advances in Microelectronics: Reviews’, Book Series, Vol. 3