Conference Information
SLIP 2019: International Workshop on System Level Interconnect Prediction
http://www.sliponline.org/Submission Date: |
2019-03-22 |
Notification Date: |
2019-04-07 |
Conference Date: |
2019-06-02 |
Location: |
Las Vegas, Nevada, USA |
Years: |
21 |
Viewed: 14114 Tracked: 0 Attend: 0
Call For Papers
Technical topics include but are not limited to:
Learning and predictive models for optimizing interconnect at various IC and system design stages
System-level design for FPGAs, NoCs, reconfigurable systems
Design, analysis, and (co)optimization of power and clock networks
Topologies and fabrics of multi- and many-core architectures
Power consumption of interconnects
System level reliability, aging, and thermal issues
Security-aware power/clock delivery and interconnect design
Design-for-manufacturing (DFM) and yield techniques for interconnects
High speed chip-to-chip interconnect
Design and analysis of chip-package interfaces
3D interconnect design and prediction
Applications of interconnects to social, genetic, and biologicalsystems
Emerging interconnect technologies in machine learning platforms & chips
Last updated by Dou Sun in 2019-03-31
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|---|---|---|
| IEEE Journal on Selected Areas in Communications | 17.2 | IEEE |
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| Internet and Higher Education | 6.8 | Elsevier |
| ACM Transactions on Computer-Human Interaction | 6.6 | ACM |
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| Flow Measurement and Instrumentation | 2.300 | Elsevier |
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