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SLIP 2019: International Workshop on System Level Interconnect Prediction

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SLIP
截稿日期:
2019-03-22
通知日期:
2019-04-07
会议日期:
2019-06-02
会议地点:
Las Vegas, Nevada, USA
届数:
21
浏览: 15687   关注: 0   参加: 0

征稿

SLIP 2019 (International Workshop on System Level Interconnect Prediction) is an academic conference held in Las Vegas, Nevada, USA on 2019-06-02. The paper submission deadline is 2019-03-22. Acceptance notifications are sent on 2019-04-07.

Technical topics include but are not limited to: Learning and predictive models for optimizing interconnect at various IC and system design stages System-level design for FPGAs, NoCs, reconfigurable systems Design, analysis, and (co)optimization of power and clock networks Topologies and fabrics of multi- and many-core architectures Power consumption of interconnects System level reliability, aging, and thermal issues Security-aware power/clock delivery and interconnect design Design-for-manufacturing (DFM) and yield techniques for interconnects High speed chip-to-chip interconnect Design and analysis of chip-package interfaces 3D interconnect design and prediction Applications of interconnects to social, genetic, and biologicalsystems Emerging interconnect technologies in machine learning platforms & chips
由 Dou Sun 最后更新于

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